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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
 Results 1 - 11 of 11  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
PN, EMT, OPE, EST, MWP, LQE, IEE-EMT [detail] 2019-01-17
11:40
Osaka Osaka University Nakanoshima Center A study of deep dry etching for Photonic Crystal CirD Laser
Li Zeng, Shun Mizoguchi, Xiuyu Zhang, Kento Takeuchi, Hirotake Kajii, Masato Morifuji, Akihiro Maruta, Masahiko Kondow (Osaka Univ.) PN2018-35 EMT2018-69 OPE2018-144 LQE2018-154 EST2018-82 MWP2018-53
In order to fabricate a photonic crystal laser with circular defect (CirD) resonator, we study deep dry etching of GaAs ... [more] PN2018-35 EMT2018-69 OPE2018-144 LQE2018-154 EST2018-82 MWP2018-53
pp.23-26
ED 2016-10-26
11:00
Mie   A verification of formation process of emitters with nano-protrusion fabricated by the field-induced oxygen etching
Minoru Wakamoto, Shigekazu Nagai, Tatsuo Iwata, Kazuo Kajiwara, Koichi Hata (MIe Univ.) ED2016-54
Focused ion beam systems equipped with liquid metal ion source has serious problems which are pollutions of samples due ... [more] ED2016-54
pp.51-56
EID, SDM 2015-12-14
11:00
Kyoto Ryukoku University, Avanti Kyoto Hall Fabrication of FinFET Structure with High Selectivity Etching Using Newly Developed SiNx Etch Gas
Takashi Kojiri (Tohoku Univ./ZEON), Tomoyuki Suwa, Keiichi Hashimoto, Akinobu Teramoto, Rihito Kuroda, Shigetoshi Sugawa (Tohoku Univ.) EID2015-9 SDM2015-92
We evaluated the properties of newly developed SiNx etch gas (SSY525). The gas indicated high selectivity as 30 ~ 60 for... [more] EID2015-9 SDM2015-92
pp.1-4
ED 2015-10-23
11:50
Aichi   Influence of height and atomic arrangement of nano-protrusion of gas field ion emitter on He-ion current
Shigekazu Nagai, Shu Katoh, Tatsuo Iwata, Kazuo Kajiwara, Koichi Hata (Mie Univ.) ED2015-67
Gas field ion sources(GFIS) with high brightness property have serious problem on a low angular current density, so that... [more] ED2015-67
pp.65-68
SDM 2013-12-13
17:40
Nara NAIST Structural Change of Silicon Carbide Surface Etched by Chlorine-Trifluoride
Ryota Hori, Tomoaki Hatayama, Hiroshi Yano, Takashi Fuyuki (NAIST) SDM2013-134
Silicon carbide surface with 4°-off toward <11-20> was chemically etched by chlorine-trifluoride gas without plasma. The... [more] SDM2013-134
pp.107-112
SDM 2012-12-07
10:15
Kyoto Kyoto Univ. (Katsura) Plasmaless etching of silicon carbide using chlorine based gas
Tomoaki Hatayama, Ryouta Hori, Tetsuya Tamura, Hiroshi Yano, Takashi Fuyuki (NAIST) SDM2012-116
Silicon carbide (SiC) could be etched by a plasmaless process in chlorine based ambient over 900oC. The etch pits were f... [more] SDM2012-116
pp.7-12
ED, SDM, CPM 2012-05-18
09:25
Aichi VBL, Toyohashi Univ. of Technol. Interface characterization of GaN-based MOS heterostructures employing ICP-etched AlGaN surfaces
Zenji Yatabe, Yujin Hori, Sungsik Kim, Tamotsu Hashizume (Hokkaido Univ.) ED2012-27 CPM2012-11 SDM2012-29
Our aim is to investigate the effects of dry etching of AlGaN surface on interface properties of GaN-based MOS structure... [more] ED2012-27 CPM2012-11 SDM2012-29
pp.49-52
LQE, ED, CPM 2011-11-17
13:20
Kyoto Katsura Hall,Kyoto Univ. Interface characterization of MOS structures fabricated on dry-etched GaN and AlGaN
Sungsik Kim, Yujin Hori, Zenji Yatabe, Tamotsu Hashizume (Hokkaido Univ.) ED2011-78 CPM2011-127 LQE2011-101
We have investigated impacts of dry etching of GaN and AlGaN surfaces on interface properties of GaN-based MOS structure... [more] ED2011-78 CPM2011-127 LQE2011-101
pp.25-28
SDM 2010-02-05
11:20
Tokyo Kikai-Shinko-Kaikan Bldg. Feasibility Study of 70nm Pitch Cu/Porous Low-k D/D Integration Featuring EUV Lithography toward 22nm Generation
Naofumi Nakamura, Noriaki Oda, Eiichi Soda, Nobuki Hosoi, Akifumi Gawase, Hajime Aoyama, Y. Tanaka, D. Kawamura, S. Chikaki, M. Shiohara, Nobuaki Tarumi, S. Kondo, Ichiro Mori, S. Saito (SELETE) SDM2009-184
A feasibility study of 70 nm pitch 2-level dual damascene interconnects featuring EUV lithography is presented. Using Ru... [more] SDM2009-184
pp.13-18
ED, LQE, CPM 2009-11-19
09:00
Tokushima Univ. of Tokushima (Josanjima Campus, Kogyo-Kaikan) GaN Re-growth Using Ta Mask Which Etches Covering GaN Layer
Kohei Hara, Yoshiki Naoi, Shiro Sakai (Univ. of Tokushima) ED2009-128 CPM2009-102 LQE2009-107
Two step growth of GaN is performed, and the metal which is selectively sandwiched into GaN is formed. A GaN downward is... [more] ED2009-128 CPM2009-102 LQE2009-107
pp.1-4
ED 2009-06-11
16:50
Tokyo   A study on low damage dry etching for AlGaN/GaN-HEMT
Masahiko Kuraguchi, Miki Yumoto, Yoshiharu Takada, Kunio Tsuda (Toshiba Corp.) ED2009-43
Recessed gate structure is promising to improve GaN electric devices. Low damage dry etching technique is required to fo... [more] ED2009-43
pp.37-40
 Results 1 - 11 of 11  /   
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