IEICE Technical Committee Submission System
Conference Schedule		 Online Proceedings
[Sign in]
Tech. Rep. Archives
    [Japanese] / [English] 
( Committee/Place/Topics  ) --Press->
 
( Paper Keywords:  /  Column:Title Auth. Affi. Abst. Keyword ) --Press->

All Technical Committee Conferences  (Searched in: All Years)

Search Results: Conference Papers
 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
 Results 1 - 7 of 7  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
CPM 2023-07-31
14:40		 Hokkaido
(Primary: On-site, Secondary: Online)		 Evaluation of VUV Absorption Characteristics in Surface Modification of Dielectric Resin Materials by VUV Light
Shinichi Endo, Yuki Ishikawa (Osaka Prefecture University), Hina Shirakashi, Takeyasu Saito (Osaka Metropolitan univ.) CPM2023-13		 Since resin generally absorbs vacuum ultraviolet (VUV) light well, it is thought that the VUV light reaching the inside ... [more] CPM2023-13
pp.7-10
EMD, R 2017-02-17
16:00		 Shiga Omuron Kusatsu Factory Study on the Relation between Filler of the Adhesive and Functions of Mechanical Devices
Osmau Ohtani, Tomohiro Fukuhara (Omron Corp.) R2016-68 EMD2016-95		 The adhesives for the mechanical device such as Relay or Switch are required the tracking resistance, the contact reliab... [more] R2016-68 EMD2016-95
pp.49-52
MW 2013-12-19
15:55		 Saitama Saitama Univ. Observation of Temperature Changes of Carbon Nanotube Doped Epoxy Resin under Millimeter-Wave Irradiation
Kensuke Tamura, Masaki Tanaka (Akita NCT) MW2013-161		 Recently, carbon nanotube (CNT) is attractive material as radio wave absorber for microwave and millimeter-wave. In this... [more] MW2013-161
pp.59-64
OME 2010-10-22
14:15		 Tokyo NTT Musashino R&D Center Vapor deposition polymerization of epoxy polymer thin films
Shigekazu Fukui (Tokyo Univ. Agricul. & Technol.), Akio Sugiura, Akira Shintai, Kazuo Kato (DENSO), Kuniaki Tanaka, Hiroaki Usui (Tokyo Univ. Agricul. & Technol.) OME2010-49		 Thin films of epoxy resin were deposited by vapor deposition polymerization, coevaporating diepoxide monomer and diamine... [more] OME2010-49
pp.15-20
EMD, R 2010-02-19
13:00		 Osaka   A Study on Improvement for Seal property of Electromechanical Devices -- The behavior of One-Part Epoxy Resin in a narrow gap --
Osamu Otani, Seiji Nakajima, Tomohiro Fukuhara (OMRON Corp.) R2009-51 EMD2009-118		 Generally, one-part epoxy resin consists of liquid epoxy monomer, solid curing agent, and filler as a packing agent and ... [more] R2009-51 EMD2009-118
pp.7-11
EMD 2009-10-30
17:05		 Tokyo   The Influence of Afhesives for Heat Resistant Sealing Characteristic for Relay
Tomohiro Fukuhara (OMRON Corp.) EMD2009-67		 In recent years, electronics components has a trend of increasing Surface Mount type because of needs for densely array ... [more] EMD2009-67
pp.51-56
OPE, EMD, CPM, LQE 2009-08-21
16:15		 Miyagi   Adhesive Technology of Electronics Devices
Tomohiro Fukuhara (OMRON Corp.) EMD2009-56 CPM2009-80 OPE2009-104 LQE2009-63		 Relays are used for various purposes, and are demand for high reliability. Especially, Sealing relays are packaged with ... [more] EMD2009-56 CPM2009-80 OPE2009-104 LQE2009-63
pp.157-162
 Results 1 - 7 of 7  /   
Choose a download format for default settings. [NEW !!]
Text format pLaTeX format CSV format BibTeX format
Copyright and reproduction : All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)

[Return to Top Page]

[Return to IEICE Web Page]
The Institute of Electronics, Information and Communication Engineers (IEICE), Japan