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Committee Date Time Place Paper Title / Authors Abstract Paper #
LQE, OPE, CPM, EMD, R 2023-08-25
09:50		 Miyagi Tohoku university
(Primary: On-site, Secondary: Online)		 [Invited Talk] Progress and Future Prospect of Photonic Integrated Devices using InP Chip/SOI Wafer Bonding Technique
Hideki Yagi (PETRA), Nobuhiko Nishiyama (Tokyo Tech), Naoki Fujiwara, Masaki Yanagisawa (PETRA) R2023-28 EMD2023-23 CPM2023-33 OPE2023-72 LQE2023-19		 The development of beyond fifth-generation (5G) and sixth-generation (6G) mobile communication systems is accelerating t... [more] R2023-28 EMD2023-23 CPM2023-33 OPE2023-72 LQE2023-19
pp.59-62
LQE, OPE, SIPH 2018-12-06
17:10		 Tokyo Keio University Examination of Chip-on-Wafer Plasma Activated Bonding Technology for III-V on Si hybrid Photonic Integrated Circuits
LIU BAI (Tokyo Tech), Takehiko Kikuchi (SEI), Takuya Mitarai, Nobuhiko Nishiyama (Tokyo Tech), Hideki Yagi (SEI), Tomohiro Amemiya, Shigehisa Arai (Tokyo Tech) OPE2018-127 LQE2018-137 SIPH2018-43		  [more] OPE2018-127 LQE2018-137 SIPH2018-43
pp.149-153
SDM, ICD 2013-08-01
13:00		 Ishikawa Kanazawa University [Invited Talk] Tera-Scale Three-Dimensional Integration (3DI) using Bumpless TSV Interconnects
Takayuki Ohba (Tokyo Inst. of Tech.) SDM2013-70 ICD2013-52		 In combination with 3D logic, memory, and cooling devices, it is possible to construct a roadmap towards high-density in... [more] SDM2013-70 ICD2013-52
pp.29-30
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