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Committee Date Time Place Paper Title / Authors Abstract Paper #
SDM, ICD 2013-08-01
13:00		 Ishikawa Kanazawa University [Invited Talk] Tera-Scale Three-Dimensional Integration (3DI) using Bumpless TSV Interconnects
Takayuki Ohba (Tokyo Inst. of Tech.) SDM2013-70 ICD2013-52		 In combination with 3D logic, memory, and cooling devices, it is possible to construct a roadmap towards high-density in... [more] SDM2013-70 ICD2013-52
pp.29-30
IE, ITS, ITE-AIT, ITE-ME 2005-02-03
10:00		 Hokkaido   -
Kazuya Hayase, Toshihiko Yamasaki, Kiyoharu Aizawa (Univ. of Tokyo) 		Bump maps are often used to achieve more realistic in rendering graphic models. Recently, the number of bump maps and th... [more] ITS2004-40 IE2004-174
pp.1-6
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