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Committee Date Time Place Paper Title / Authors Abstract Paper #
VLD, DC, CPSY, RECONF, CPM, ICD, IE, IPSJ-SLDM, IPSJ-EMB, IPSJ-ARC
(Joint) [detail]		 2017-11-07
09:50		 Kumamoto Kumamoto-Kenminkouryukan Parea Performance Evaluation Three Dimensional FPGA Architecture with Face-down Stacking
Keishiro Akashi, Motoki Amagasaki, Qian Zhao, Masahiro Iida, Morihiro Kuga, Toshinori Sueyoshi (Kumamoto Univ) RECONF2017-42		 In recent years,Three-dimensional (3D) field-programmable gate arrays(FPGAs) are expected to offer higher logic density ... [more] RECONF2017-42
pp.31-36
VLD, DC, CPSY, RECONF, CPM, ICD, IE
(Joint) [detail]		 2016-11-29
10:55		 Osaka Ritsumeikan University, Osaka Ibaraki Campus Development of power estimation tool for three dimensional FPGA
Masato Ikebe, Qian Zhao, Motoki Amagasaki, Masahiro Iida, Morihiro Kuga, Toshinori Sueyoshi (Kumamoto Univ.) RECONF2016-46		 Three-dimensional (3D) stacking technology is attractive for providing another way to improve the performance of the lar... [more] RECONF2016-46
pp.35-40
RECONF 2015-06-19
12:00		 Kyoto Kyoto University An Area Optimization of 3D FPGA with high speed inter-layer communication link
Yuto Takeuchi, Qian Zhao, Motoki Amagasaki, Masahiro Iida, Morihiro Kuga, Toshinori Sueyoshi (Kumamoto Univ) RECONF2015-4		 Three-dimensional (3D) stacking technology is attractive for providing another way to improve the performance of the lar... [more] RECONF2015-4
pp.17-22
RECONF, CPSY, VLD, IPSJ-SLDM [detail] 2015-01-29
11:05		 Kanagawa Hiyoshi Campus, Keio University Exploring 3D FPGA Architectures to Minimize the Number of Inter-layer Connections
Qian Zhao, Motoki Amagasaki, Masahiro Iida, Morihiro Kuga, Toshinori Sueyoshi (Kumamoto Univ.) VLD2014-120 CPSY2014-129 RECONF2014-53		 The 3D IC technology is being researched to build better performance LSIs in a variety of applications when the process ... [more] VLD2014-120 CPSY2014-129 RECONF2014-53
pp.41-46
RECONF 2014-06-12
11:15		 Miyagi Katahira Sakura Hall Three-dimensional FPGA Structure using High-speed Serial Communication
Takuya Kajiwara, Motoki Amagasaki, Masahiro Iida, Morihiro Kuga, Toshinori Sueyoshi (Kumamoto Univ.) RECONF2014-7		 The three-dimensional (3D) integrated circuit technology is expected to continually improve the LSI (Large Scale Integra... [more] RECONF2014-7
pp.31-36
 Results 1 - 5 of 5  /   
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