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Committee Date Time Place Paper Title / Authors Abstract Paper #
VLD, DC, CPSY, RECONF, ICD, IE, IPSJ-SLDM, IPSJ-EMB, IPSJ-ARC
(Joint) [detail]		 2019-11-15
15:20		 Ehime Ehime Prefecture Gender Equality Center Evaluation of Inter-chip Inductive Coupling Wireless Communication Technology
Hideto Kayashima, Takuya Kojima, Hayate Okuhara, Tsunaaki Shidei, Hideharu Amano (Keio Univ.) CPSY2019-48		 Building block computing systems, which is one of the three-dimensional stacked LSI systems, use a wireless communicatio... [more] CPSY2019-48
pp.59-64
VLD, DC, CPSY, RECONF, CPM, ICD, IE, IPSJ-SLDM, IPSJ-EMB, IPSJ-ARC
(Joint) [detail]		 2018-12-07
15:15		 Hiroshima Satellite Campus Hiroshima Real Chip Implementation of a verification scheme for an Inductive-Coupling ThruChip Interface
Hideto Kayashima, Takuya Kojima, Hayate Okuhara, Hideharu Amano (Keio Univ.) CPSY2018-42		 A building block computing system is one of the promising 3D Stacked VLSIs. It adopts an inductive coupling ThruChip Int... [more] CPSY2018-42
pp.53-58
EMT, IEE-EMT 2016-11-17
11:50		 Wakayama Shirahama Coganoi Resort & Spa Nondestructive Inspection of Airport Taxiways by Multi-Static Array GPR “YAKUMO”
Zou Lilong, Sato Motoyuki (Tohoku Univ.) EMT2016-50		 In this paper, a multi-statics GPR “YAKUMO” was applied to inspect the health of airport taxiway. The GPR YAKUMO consist... [more] EMT2016-50
pp.71-76
RECONF, CPSY, VLD, IPSJ-SLDM [detail] 2015-01-30
17:30		 Kanagawa Hiyoshi Campus, Keio University A Cache to Cache Communication Strategy for Wireless 3D Multi-Core Processors
Masataka Matsumura (UEC), Masaaki Kondo (Univ. Tokyo), Hiroki Matsutani (Keio Univ.), Yasutaka Wada (Waseda Univ.), Hiroki Honda (UEC) VLD2014-152 CPSY2014-161 RECONF2014-85		 The inductive-coupling 3D chip stacking technique has several advantages over TSV-based 3D stacking. For example, its ma... [more] VLD2014-152 CPSY2014-161 RECONF2014-85
pp.245-250
VLD, DC, IPSJ-SLDM, CPSY, RECONF, ICD, CPM
(Joint) [detail]		 2012-11-27
09:00		 Fukuoka Centennial Hall Kyushu University School of Medicine A Routing Strategy for 3-D NoCs Incorporating Bus and Network
Takahiro Kagami, Hiroki Matsutani (Keio Univ.), Michihiro Koibuchi (NII), Hideharu Amano (Keio Univ.) CPSY2012-50		 Inductive coupled 3-D chip stacking technique allows to change types and
numbers of stacked chips after fabrication.
A... [more]		 CPSY2012-50
pp.15-20
 Results 1 - 5 of 5  /   
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