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All Technical Committee Conferences (Searched in: All Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
CPM, SDM, ED |
2011-05-19 10:50 |
Aichi |
Nagoya Univ. (VBL) |
Correlation between strain fields and excess carrier lifetime maps in 3C-SiC wafer Atsushi Yoshida, Masashi Kato, Masaya Ichimura (Nagoya Inst. of Tech.) ED2011-5 CPM2011-12 SDM2011-18 |
3C-SiC is a promising material for low loss and high voltage power devices. However realization of 3C-SiC devices is dif... [more] |
ED2011-5 CPM2011-12 SDM2011-18 pp.21-26 |
CPM, ED, SDM |
2008-05-16 15:05 |
Aichi |
Nagoya Institute of Technology |
Characterization of epitaxial p-type 4H-SiC layers by the microwave photoconductivity decay method Yoshinori Matsushita, Masashi Kato, Masaya Ichimura (NIT), Tomoaki Hatayama (NAIST), Takeshi Ohshima (JAEA) ED2008-20 CPM2008-28 SDM2008-40 |
Silicon Carbide (SiC) is a promising material for high power and high frequency devices. However we cannot transfer thes... [more] |
ED2008-20 CPM2008-28 SDM2008-40 pp.95-100 |
ED, SDM |
2007-06-25 15:55 |
Overseas |
Commodore Hotel Gyeongju Chosun, Gyeongju, Korea |
Analysis of plasma etching damages in GaN by excess carrier lifetime measurements Masashi Kato, Keisuke Fukushima, Masaya Ichimura (Nagoya Inst. of Tech.), Masakazu Kanechika, Osamu Ishiguro, Tetsu Kachi (Toyota Central R&D Labs.) |
Gallium nitride (GaN) is a promising material for high power and high frequency devices, and the etching processes are n... [more] |
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SDM, ED, CPM |
2007-05-24 14:50 |
Shizuoka |
Shizuoka Univ. |
Analysis of plasma etching damages and characterization of annealing effects on GaN by excess carrier lifetime measurements Keisuke Fukushima, Masashi Kato, Masaya Ichimura (Nagoya Inst. of Tech.), Masakazu Kanechika, Osamu Ishiguro, Tetsu Kachi (Toyota Central R&D Labs., Inc.) |
Gallium nitride (GaN) is promising for high power and high frequency devices, and the etching processes is necessary in ... [more] |
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