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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
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Committee Date Time Place Paper Title / Authors Abstract Paper #
MW 2012-10-19
09:20
Tochigi Utsunomiya Univ. Experimental study on the microwave surface resistance of the copper-clad dielectric substrates
Yusuke Shimoda, Koichi Kikuchi, Takashi Shimizu, Yoshinori Kogami (Utsunomiya Univ.) MW2012-98
Copper clad dielectric substrate is used for high-frequency planar circuits. The surface of the dielectric plate is roug... [more] MW2012-98
pp.99-104
RCS, MoNA, SR
(Joint)
2011-03-04
10:50
Kanagawa YRP A Study on Precoding Prediction in LTE Downlink
Yusuke Shimoda (Hokkaido Univ.), Yoshihisa Kishiyama (NTT DOCOMO), Toshihiko Nishimura, Takeo Ohgane, Yasutaka Ogawa (Hokkaido Univ.) RCS2010-303
 [more] RCS2010-303
pp.319-323
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