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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
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Committee Date Time Place Paper Title / Authors Abstract Paper #
OPE 2012-12-21
Tokyo Kikai-Shinko-Kaikan Bldg. Characteristics of InP-based passive devices of Si substrate with BCB adhesive wafer bonding for on-chip interconnects
Jieun Lee, Yoshiaki Yamahara, Yuki Atsumi, Nobuhiko Nishiyama (TiTech), Shigehisa Arai (TiTech/QNERC)
For InP-based membrane photonic circuits on Si-LSI, a GaInAsP wire waveguide and basic functional passive devices based ... [more] OPE2012-141
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