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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
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Committee Date Time Place Paper Title / Authors Abstract Paper #
SDM 2019-02-07
Tokyo   [Invited Talk] Grain-Boundary-Crystallinity Dependence of Mechanical Properties and EM Resistance of Electroplated Copper Interconnections
Yifan Luo, Yutaro Nakoshi, Ryota Mizuno, Ken Suzuki, Hideo Miura (Tohoku Univ.) SDM2018-94
 [more] SDM2018-94
SDM 2018-11-08
Tokyo Kikai-Shinko-Kaikan Bldg. [Invited Talk] Development of the evaluation method of the strength of polycrystalline materials based on the order of atom arrangement and its application to the strength evaluation of electroplated copper thin films
Ken Suzuki, Yifan Luo, Hideo Miura (Tohoku Univ.) SDM2018-68
 [more] SDM2018-68
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