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Committee Date Time Place Paper Title / Authors Abstract Paper #
SDM 2019-02-07
13:10
Tokyo   [Invited Talk] Stress Investigation of Annular-Trench-Isolated (ATI) Through Silicon Via (TSV)
Wei Feng, Naoya Watanabe, Haruo Shimamoto, Masahiro Aoyagi, Katsuya Kikuchi (AIST) SDM2018-93
The methods as parylene substitute of SiO2 as dielectric layer and annular structure lose efficacy for thermal stress re... [more] SDM2018-93
pp.9-14
SANE 2014-10-23
12:00
Overseas Ramada Plaza Melaka, Malacca, Malaysia Contactless Heart beat Measurement Using Webcam
Liew Qing Yin, Koo Voon Chet, Lim Chot Hun (MMU), Voon Wei Feng, Lau Ting En (Myreka Technologies)
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