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All Technical Committee Conferences (Searched in: All Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
ICD, ITE-IST |
2015-07-03 13:30 |
Kanagawa |
National Defense Academy |
[Invited Talk]
Introduction of Utility Infrastructure Core Monitoring System (UCoMS) Development Project and Application of Piezoelectric MEMS Toshihiro Itoh (Univ. Tokyo), Takeshi Kobayashi (AIST) ICD2015-21 |
[more] |
ICD2015-21 pp.41-45 |
SDM, ED |
2009-06-25 12:30 |
Overseas |
Haeundae Grand Hotel, Busan, Korea |
Study of a PMD tolerance extension by InP HBT analog EDC IC without adaptive control in 43G DQPSK transmission Toshihiro Itoh, Kimikazu Sano, Hiroyuki Fukuyama, Koichi Murata (NTT) ED2009-80 SDM2009-75 |
We experimentally studied the polarization mode dispersion (PMD) tolerance of an feed-forward equalizer (FFE) electronic... [more] |
ED2009-80 SDM2009-75 pp.133-136 |
MW, ED |
2009-01-15 14:25 |
Tokyo |
Kikai-Shinko-Kaikan Bldg |
Two-channel InP HBT Differential Automatic-gain-control Transimpedance Amplifier IC for 43-Gbit/s DQPSK Photoreceiver Hiroyuki Fukuyama, Toshihiro Itoh, Tomofumi Furuta, Kenji Kurishima, Masami Tokumitsu, Koichi Murata (NTT) ED2008-213 MW2008-178 |
We have developed a two-channel automatic-gain-control transimpedance amplifier IC by using InP heterojunction bipolar t... [more] |
ED2008-213 MW2008-178 pp.89-94 |
ICD, CPM |
2007-01-19 09:25 |
Tokyo |
Kika-Shinko-Kaikan Bldg. |
Ultra-Fine Pitch Cu Bumpless Interconnect for High Density System Integration Aktisu Shigetou, Toshihiro Itoh, Tadatomo Suga (Univ. of Tokyo) |
We report the studies on the ultra-fine pitch Cu bumpless interconnect relating to the direct bonding of CMP-Cu done by ... [more] |
CPM2006-142 ICD2006-184 pp.77-81 |
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