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Committee Date Time Place Paper Title / Authors Abstract Paper #
SDM 2020-02-07
10:10
Tokyo Tokyo University-Hongo [Invited Talk] Stability of Cu Interconnect Surface after post CMP Cleaning
Yasuhiro Kawase, Toshiaki Shibata, Tomohiro Kusano (MCC), Ken Harada (imec), Kan Takeshita (MCC) SDM2019-90
At present, more than 12 Cu interconnect layers have been formed in advanced semiconductor devices and each layer is pla... [more] SDM2019-90
pp.9-14
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