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All Technical Committee Conferences (Searched in: All Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
VLD, DC, IPSJ-SLDM, CPSY, RECONF, ICD, CPM (Joint) [detail] |
2013-11-27 16:10 |
Kagoshima |
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[Invited Talk]
Chip Thinning Technologies for Chip Stacking Packages Shinya Takyu, Tetsuya Kurosawa (Toshiba) VLD2013-76 CPM2013-120 ICD2013-97 CPSY2013-61 DC2013-42 RECONF2013-44 |
[more] |
VLD2013-76 CPM2013-120 ICD2013-97 CPSY2013-61 DC2013-42 RECONF2013-44 pp.107-112(VLD), pp.69-74(CPM), pp.69-74(ICD), pp.15-20(CPSY), pp.107-112(DC), pp.27-32(RECONF) |
CPM, ICD |
2008-01-18 14:55 |
Tokyo |
Kikai-Shinko-Kaikan Bldg |
Chip Thinning Technologies Realizing High Chip Strength Shinya Takyu, Tetsuya Kurosawa, Noriko Shimizu, Susumu Harada (Toshiba Co.) CPM2007-145 ICD2007-156 |
Accompanying the rapid progress of the digital network information society, there is strong demand for high functionalit... [more] |
CPM2007-145 ICD2007-156 pp.99-103 |
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