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Committee Date Time Place Paper Title / Authors Abstract Paper #
VLD, DC, IPSJ-SLDM, CPSY, RECONF, ICD, CPM
(Joint) [detail]
2013-11-27
16:10
Kagoshima   [Invited Talk] Chip Thinning Technologies for Chip Stacking Packages
Shinya Takyu, Tetsuya Kurosawa (Toshiba) VLD2013-76 CPM2013-120 ICD2013-97 CPSY2013-61 DC2013-42 RECONF2013-44
 [more] VLD2013-76 CPM2013-120 ICD2013-97 CPSY2013-61 DC2013-42 RECONF2013-44
pp.107-112(VLD), pp.69-74(CPM), pp.69-74(ICD), pp.15-20(CPSY), pp.107-112(DC), pp.27-32(RECONF)
CPM, ICD 2008-01-18
14:55
Tokyo Kikai-Shinko-Kaikan Bldg Chip Thinning Technologies Realizing High Chip Strength
Shinya Takyu, Tetsuya Kurosawa, Noriko Shimizu, Susumu Harada (Toshiba Co.) CPM2007-145 ICD2007-156
Accompanying the rapid progress of the digital network information society, there is strong demand for high functionalit... [more] CPM2007-145 ICD2007-156
pp.99-103
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