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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
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Committee Date Time Place Paper Title / Authors Abstract Paper #
SDM 2012-10-26
Miyagi Tohoku Univ. (Niche) Ultra high speed wet etching technology for a silicon wafer process
Takeshi Sakai, Tatsuro Yoshida, Kazuhiro Yoshikawa, Tadahiro Ohmi (Tohoku Univ.) SDM2012-97
The silicon wafer thinning technology is important in three-dimensional integrated technology. In this paper, we conside... [more] SDM2012-97
SDM 2011-10-21
Miyagi Tohoku Univ. (Niche) Silicon Wafer Wet Etching for Plug Protrusion of 3D chip-stacking technology with Through Silicon Via
Kazuhiro Yoshikawa (PretechAT), Tatsuro Yoshida, Kazuki Soeda, Ryousuke Hiratuka, Tadahiro Ohmi (Tohoku Univ.) SDM2011-114
 [more] SDM2011-114
SDM 2009-10-29
Miyagi Tohoku University Silicon Wafer Thinning Technology for Three-Dimensional Integrated Circuit by Wet Etching
Kazuhiro Yoshikawa, Tomotsugu Ohashi, Tatsuro Yoshida, Takenao Nemoto, Tadahiro Ohmi (Tohoku Univ.) SDM2009-120
A three-dimensional integrated circuit is developed as an emerging technology in a semiconductor industry. The silicon w... [more] SDM2009-120
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