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All Technical Committee Conferences (Searched in: All Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
SDM |
2022-02-04 09:05 |
Online |
Online |
[Invited Talk]
Quantitative evaluation on barrier property of ultra-thin PVD-Co(W) films using lag-time method Takeshi Momose, Taewoong Kim, Yubin Deng, Momoko Deura (UTokyo), Akira Matsuo, Nobuo Yamaguchi (CANON ANELVA), Yukihiro Shimogaki (UTokyo) SDM2021-74 |
For the development of ultra-thin barrier layers for Cu interconnections in ultra large scale integration, it is essenti... [more] |
SDM2021-74 pp.1-4 |
SDM |
2016-01-22 13:55 |
Tokyo |
Sanjo Conference Hall, The University of Tokyo |
Fabrication of highly reliable Co(W) thin film by physical vapor deposition for next generation ULSI Cu interconnects Taewoong Kim, Kouta Tomita, Takeshi Momose (Univ. of Tokyo), Takaaki Tsunoda, Takayuki Moriwaki (CANON ANELVA), Yukihiro Shimogaki (Univ. of Tokyo) SDM2015-114 |
[more] |
SDM2015-114 pp.25-28 |
SDM |
2015-03-02 15:25 |
Tokyo |
Kikai-Shinko-Kaikan Bldg |
[Invited Talk]
Sub-nanoscale Structure and Barrier Performance of CVD-Cu(Mn)/ALD-Co(W) Interconnect System Proved Using 3D Atom Probe Kohei Shima (The Univ. of Tokyo), Yuan Tu, Bin Han, Hisashi Takamizawa (Tohoku Univ.), Hideharu Shimizu (The Univ. of Tokyo), Yasuo Shimizu (Tohoku Univ.), Takeshi Momose (The Univ. of Tokyo), Koji Inoue, Yasuyoshi Nagai (Tohoku Univ.), Yukihiro Shimogaki (The Univ. of Tokyo) SDM2014-169 |
We propose new materials system of a single layered Co(W) barrier/liner layer coupled with a Cu(Mn) alloy seed layer for... [more] |
SDM2014-169 pp.39-44 |
SDM |
2012-03-05 13:30 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Single-layered barrier/liner Co(W) by ALD/CVD for next generation ULSI-Cu interconnect Hideharu Shimizu (Taiyo Nippon Sanso/Tokyo Univ.), Kohei Shima, Takeshi Momose (Tokyo Univ.), Yoshihiko Kobayashi (Taiyo Nippon Sanso), Yukihiro Shimogaki (Tokyo Univ.) SDM2011-180 |
The effective resistivity of interconnects are predicted to be increased by ULSI shrinking. Barrier/liner layer formed o... [more] |
SDM2011-180 pp.25-29 |
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