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Committee Date Time Place Paper Title / Authors Abstract Paper #
SDM 2020-02-07
14:55
Tokyo Tokyo University-Hongo [Invited Talk] A THIN BONDING MATERIAL FOR HIGH DENSITY HETEROGENEOUS INTEGRATION
Yasuhisa Kayaba, Yuzo Nakamura, Jun Kamada, Takashi Kozeki, Kazuo Kohmura (MCI) SDM2019-95
A new thin bonding material was developed for the heterogeneous device chip integration by Cu-Cu hybrid bonding. The bon... [more] SDM2019-95
pp.31-34
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