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All Technical Committee Conferences (Searched in: All Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
SDM |
2008-03-14 15:25 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Through-silicon Via Interconnection for 3D Integration Using Room-temperature Bonding Naotaka Tanaka, Yasuhiro Yoshimura, Michihiro Kawashita (Hitachi), Toshihide Uematsu, Takahiro Naitoh, Takashi Akazawa (Renesas) SDM2007-277 |
One approach to 3D technology is chip stacking using through-silicon vias (TSVs). Interconnects in a 3D assembly are pot... [more] |
SDM2007-277 pp.21-26 |
ICD, CPM |
2005-09-08 13:00 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
System Packaging Issue and Solution of Renesas SiP Noriaki Sakamoto, Norihiko Sugita, Takafumi Kikuchi, Hideki Tanaka, Takashi Akazawa (ルネサステクノロジ) |
[more] |
CPM2005-90 ICD2005-100 pp.31-34 |
ICD |
2005-04-14 19:00 |
Fukuoka |
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* Katsuyuki Sato (Elpida), Hiroyuki Yamauchi (Matsushita), Kenji Numata (Toshiba), Takashi Akazawa (Renesas), Yasunao Katayama (IBM Japan) |
[more] |
ICD2005-12 p.59 |
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