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Committee Date Time Place Paper Title / Authors Abstract Paper #
VLD, HWS, ICD 2024-02-29
10:35		 Okinawa
(Primary: On-site, Secondary: Online)		 Distributed Task Migration Algorithm for 3D Stacked Chips and Evaluation with actual measurement
Takahiro Kanamori, Songxiang Wang, Kimiyoshi Usami (SIT) VLD2023-109 HWS2023-69 ICD2023-98		 The wireless communication technique between chips in a 3D stacked chip has a problem that certain areas are difficult t... [more] VLD2023-109 HWS2023-69 ICD2023-98
pp.60-65
VLD, DC, RECONF, ICD, IPSJ-SLDM [detail] 2023-11-16
09:30		 Kumamoto Civic Auditorium Sears Home Yume Hall
(Primary: On-site, Secondary: Online)		 Leakage-current Based Charge Accumulating Aging Sensor Circuit and Evaluation of NBTI Using Fabricated Chips
Mina Fukushima, Songxiang Wang, Kaito Nagai, Kimiyoshi Usami (SIT) VLD2023-43 ICD2023-51 DC2023-50 RECONF2023-46		 Operation failure due to BTI (Bias Temperature Instability) is a critical concern. As the pMOS threshold V_th changes o... [more] VLD2023-43 ICD2023-51 DC2023-50 RECONF2023-46
pp.76-81
CAS, SIP, VLD, MSS 2022-06-16
16:10		 Aomori Hachinohe Institute of Technology
(Primary: On-site, Secondary: Online)		 Dynamic Temperature Control Algorithm for 3-D Stacked Chips based on Thermal Analysis
Songxiang Wang, Kimiyoshi Usami (Shibaura IT) CAS2022-10 VLD2022-10 SIP2022-41 MSS2022-10		 The problem of heat generation is more serious in 3D stacked chips than in non-stacked counterparts. In this study, we f... [more] CAS2022-10 VLD2022-10 SIP2022-41 MSS2022-10
pp.52-57
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