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OME 2017-12-01
09:20		 Saga Sun Messe Tosu High efficiency processing and its processing mechanism of large area diamond substrate due to plasma fusion CMP
Hidetoshi Takeda (Namiki Precision Jewel Co., Ltd.), Toshiro Doi (Kyushu Univ.), Seong Woo Kim (Namiki Precision Jewel Co., Ltd.), Hideo Aida (Nagaoka Univ. Tech.), Masaharu Shiratani (Kyushu Univ.) OME2017-35		 SiC, GaN and Diamond are known as next generation semiconductor materials, but on the other hand, these are known as ult... [more] OME2017-35
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