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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
 Results 1 - 4 of 4  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
SDM 2010-02-05
13:30
Tokyo Kikai-Shinko-Kaikan Bldg. Optimization of Metallization Processes for 32-nm node Highly Reliable Ultralow-k (k=2.4)/Cu Multilevel Interconnects Incorporating a Bilayer Low-k Barrier Cap (k=3.9)
M. Iguchi, S. Yokogawa, Hirokazu Aizawa, Y. Kakuhara, Hideaki Tsuchiya, Norio Okada, Kiyotaka Imai, M. Tohara, K. Fujii (NEC Electronics), T. Watanabe (Toshiba) SDM2009-186
Reliability of 32-nm-node ultralow-k (k=2.4)/Cu multilevel interconnects incorporating a bilayer low-k barrier cap (k=3.... [more] SDM2009-186
pp.25-29
OPE, EMD, CPM, LQE 2009-08-21
10:15
Miyagi   25 Gbps EA modulator integrated DFB laser module for 100Gbps Ethernet
Toshitsugu Uesugi, Norio Okada, Takeshi Saito, Takeshi Yamatoya, Yoshimichi Morita, Atsushi Sugitatsu (Mitsubishi Electric Corp.) EMD2009-47 CPM2009-71 OPE2009-95 LQE2009-54
Compact and cost-effective 25 Gbps EA modulator integrated DFB laser module with flexible printed circuit (FPC) electric... [more] EMD2009-47 CPM2009-71 OPE2009-95 LQE2009-54
pp.109-112
LQE 2006-12-08
13:35
Tokyo Kikai-Shinko-Kaikan Bldg. 10.7Gbit/s Low Power Consumption Cooled TOSA
Norio Okada, Shiho Zaizen, Takeshi Fujita, Yasunori Miyazaki, Atsushi Sugitatsu, Tatsuo Hatta (Mitsubishi Electric)
 [more] LQE2006-110
pp.39-42
LQE 2005-12-09
13:45
Tokyo Kikai-Shinko-Kaikan Bldg. A Study of Driving Circuit Inside 10G-bit/s Uncooled LD Module
Norio Okada, Nobuyuki Yasui, Hiroshi Aruga, Satoshi Shirai, Isao Ohshima, Atsushi Sugitatsu, Tatsuo Hatta, Hitoshi Watanabe (Mitsubishi Electric)
We have developed a low-cost 1.3-um uncooled laser diode module for XFP, XENPAK, and X2 etc. By employing the parallel c... [more] LQE2005-118
pp.25-28
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