IEICE Technical Committee Submission System
Conference Schedule
Online Proceedings
[Sign in]
Tech. Rep. Archives
    [Japanese] / [English] 
( Committee/Place/Topics  ) --Press->
 
( Paper Keywords:  /  Column:Title Auth. Affi. Abst. Keyword ) --Press->

All Technical Committee Conferences  (All Years)

Search Results: Conference Papers
 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
 Results 1 - 5 of 5  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
ITS, IE, ITE-AIT, ITE-HI, ITE-ME [detail] 2014-02-17
13:50
Hokkaido Hokkaido Univ. A generation scheme of protected templates for sparse representation-based face recognition
Masakazu Furukawa, Yuichi Muraki, Masaaki Fujiyoshi (Tokyo Metro. Univ.), Yoshihide Tonomura (NTT), Hitoshi Kiya (Tokyo Metro. Univ.) ITS2013-42 IE2013-107
 [more] ITS2013-42 IE2013-107
pp.73-78
SP, EA, SIP 2013-05-17
16:25
Okayama   A Secure Face Recognition Method Using Kernel Sparse Representation
Masakazu Furukawa, Yuichi Muraki, Masaaki Fujiyoshi, Hitoshi Kiya (Tokyo Metro. Univ.) EA2013-27 SIP2013-27 SP2013-27
 [more] EA2013-27 SIP2013-27 SP2013-27
pp.157-162
CPM 2008-08-04
14:00
Hokkaido Muroran Institute of Technology Development of Surface-Wave Plasma Generation Apparatus and Application to Semiconductor Processing
Hisashi Fukuda (Muroran Inst. Technol.), Masakazu Furukawa (ARIC) CPM2008-41
We have developed a high-density surface-wave plasma apparatus for the application to next generation semiconductor fabr... [more] CPM2008-41
pp.1-4
EMD, CPM, LQE, OPE 2006-08-25
10:05
Hokkaido Chitose Arcadia Plaza Development of Surface Wave Excitation Plasma Generation Apparatus and Application to Semiconductor Processing
Haruki Shoji, Hisashi Fukuda, Masakazu Furukawa (Muroran Inst. Tech.)
 [more] EMD2006-37 CPM2006-67 OPE2006-79 LQE2006-44
pp.67-70
MW, OPE, EMT [detail] 2006-07-28
09:45
Hokkaido   Numarical Analysis of Microwave Surface Plasma Processing by FDTD Method
Taiki Miyoshi, Hideki Kawaguchi, Masakazu Furukawa (Muroran Inst. Tech.)
The Surface-wave enhanced plasma process is advanced method of semiconductor device fabrications. However, Relation betw... [more] MW2006-67 OPE2006-59
pp.175-180
 Results 1 - 5 of 5  /   
Choose a download format for default settings. [NEW !!]
Text format pLaTeX format CSV format BibTeX format
Copyright and reproduction : All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)


[Return to Top Page]

[Return to IEICE Web Page]


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan