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Committee Date Time Place Paper Title / Authors Abstract Paper #
ICD, CPM 2005-09-09
11:20		 Tokyo Kikai-Shinko-Kaikan Bldg. Development of New Surface Finish Technology for Package Substrates with Excellent Bondability
Kiyotaka Tsukada (IBIDEN) 		This Paper describes the characteristics, development, and application of
the surface finish technologies for chip pack... [more]		 CPM2005-100 ICD2005-110
pp.23-27
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