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Committee Date Time Place Paper Title / Authors Abstract Paper #
OME 2017-12-01
09:40		 Saga Sun Messe Tosu Pad-Conditioning/Slurry-Supply Hybrid Effect of High-Pressure-Micro-Jet (HPMJ) Method During CMP Process
Keiichi Tsukamoto, Toshiro Doi (Kyushu Univ.), Chengwu Wang (Zhejiang Normal Univ.), Kiyoshi Seshimo (Kyushu Univ.), Keiji Miyachi, Mikihiro Kato (Asahi Sunac Co.), Tadakazu Miyashita (Fujikoshi Machinery Co.), Masanori Ohtsubo, Yoko Matsunaga (Kyushu Univ.) OME2017-36		 Clogging of the polishing pad is inevitable during CMP process for semiconductor wafer. Conventional reconditioning meth... [more] OME2017-36
pp.7-12
OME 2017-12-01
13:10		 Saga Sun Messe Tosu Smart polishing by applying the limelight Dilatancy-Pad -- Evaluation for Dilatancy-Pad materials and SiC substrates's polishing characteristics --
Kiyoshi Seshimo, Tshiro Doi, Masanori Ohtsubo, Keiichi Tukamoto (Kyushu Univ.), Masataka Takagi (FUJIBO Ehime), Daizo Ichikawa (Fjikoshi Machinery) OME2017-42		 Dilatancy material has hold the key to construct Smart-polishing technology for hard-to-process material substrates such... [more] OME2017-42
pp.31-36
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