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Committee Date Time Place Paper Title / Authors Abstract Paper #
EMCJ 2015-03-06
15:20		 Tokyo Kikai-Shinko-Kaikan Bldg. A Technique for Improving Isolation of Devices Using Surface-Mounted Resistors and a Metal Plate
Yasuo Morimoto, Takeshi Yuasa (Mitsubishi Electric), Kenji Maeda, Norio Takeuchi (Mitsubishi Electric Engineering), Yukihiro Tahara (Mitsubishi Electric) EMCJ2014-107		 When RF-devices are enclosed in a large metal case, coupling between a circuit and another circuit via the resonant cavi... [more] EMCJ2014-107
pp.29-34
EMCJ, WPT
(Joint)		 2014-01-30
14:30		 Saga Saga Univ. Optimization of the inter-layer connection structure for the high-speed signal
Tsuyoshi Kobayashi, Kouji Shibuya (Mitsubishi Electric), Norio Takeuchi, Kenji Maeda (Mitsubishi Electric Engineering) EMCJ2013-115		 For a miniaturization and advanced features of equipment, the high-density and quality PCB design is required.Through ho... [more] EMCJ2013-115
pp.23-26
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