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All Technical Committee Conferences (Searched in: All Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
CPM |
2023-08-01 10:05 |
Hokkaido |
(Primary: On-site, Secondary: Online) |
Evaluation of the Physical Properties of Reactive sputtered Ti or V-based MAX alloy thin film Kazuki Ueda, Kazunobu Wkamatsu, Takeyasu Saito, Naoki Okamoto (Osaka Metropolitan Univ.) CPM2023-20 |
Currently, Cu is the main wiring material in leading-edge semiconductor devices. However, since Cu easily diffuses into ... [more] |
CPM2023-20 pp.33-35 |
NS, ASN, RCC, RCS, SR (Joint) |
2017-07-19 14:35 |
Hokkaido |
Hokkaido Univ. |
A Proposal of Simultaneous Transmission of Multiple Frames to Enhance Total Throughput in Dense Wireless LAN Environments Yosuke Tanigawa, Kazuki Ueda, Kohei Omori, Hideki Tode (Osaka Prefecture Univ.) NS2017-39 |
Recently, by the increase of mobile devices like smart phones and tablets as well as note PCs, wireless LAN has been dif... [more] |
NS2017-39 pp.63-68 |
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