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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
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Committee Date Time Place Paper Title / Authors Abstract Paper #
CPM 2023-08-01
10:05
Hokkaido
(Primary: On-site, Secondary: Online)
Evaluation of the Physical Properties of Reactive sputtered Ti or V-based MAX alloy thin film
Kazuki Ueda, Kazunobu Wkamatsu, Takeyasu Saito, Naoki Okamoto (Osaka Metropolitan Univ.) CPM2023-20
Currently, Cu is the main wiring material in leading-edge semiconductor devices. However, since Cu easily diffuses into ... [more] CPM2023-20
pp.33-35
NS, ASN, RCC, RCS, SR
(Joint)
2017-07-19
14:35
Hokkaido Hokkaido Univ. A Proposal of Simultaneous Transmission of Multiple Frames to Enhance Total Throughput in Dense Wireless LAN Environments
Yosuke Tanigawa, Kazuki Ueda, Kohei Omori, Hideki Tode (Osaka Prefecture Univ.) NS2017-39
Recently, by the increase of mobile devices like smart phones and tablets as well as note PCs, wireless LAN has been dif... [more] NS2017-39
pp.63-68
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