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All Technical Committee Conferences (Searched in: All Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
SDM |
2013-02-04 14:30 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Wafer-level Chip Scale Package for White LED with High Thermal Dissipation Yosuke Akimoto, Akihiro Kojima, Miyoko Shimada, Hideyuki Tomizawa, Hideto Furuyama, Susumu Obata, Kazuhito Higuchi, Yoshiaki Sugizaki, Hideki Shibata (Toshiba) SDM2012-154 |
We proposed a novel wafer-level chip scale packaging technology for white LED, which enables high thermal dissipation fo... [more] |
SDM2012-154 pp.21-24 |
ICD, CPM |
2005-09-09 10:55 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Lead-free bumping and its process integrity for fine pitch interconnects Hirokazu Ezawa, Masaharu Seto, Kazuhito Higuchi (Toshiba) |
Electroplated solder bumps allow much finer pitch interconnection for high I/O applications, although controlling the al... [more] |
CPM2005-99 ICD2005-109 pp.17-22 |
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