IEICE Technical Committee Submission System
Conference Schedule
Online Proceedings
[Sign in]
... (for ESS/CS/ES/ISS)
Tech. Rep. Archives
... (for ES/CS)
    [Japanese] / [English] 
( Committee/Place/Topics  ) --Press->
 
( Paper Keywords:  /  Column:Title Auth. Affi. Abst. Keyword ) --Press->

All Technical Committee Conferences  (All Years)

Search Results: Conference Papers
 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
 Results 1 - 4 of 4  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
US 2017-12-11
14:45
Tokyo   Effect of Ultrasonic Vibration on Microbubble Cleaning
Shigeru Aoki, Hiroshi Ikeda, Katsumi Kurita (TMCIT), Seiji Hirai (Inst. of Technologists)
This research is aimed to clarify the relationship between frequency of ultrasonic vibration and cleaning effects. The ... [more] US2017-77
pp.17-20
US 2015-12-21
15:50
Tokyo Surugadai Campus, Nihon University Rediction Method for Residual Stress on Welded Joint Using Ultrasonic Vibrations -- Comparison with Method Using Single Ultrasonic Vibration --
Shigeru Aoki, Katsumi Kurita (Tokyo Metro. Colle. Industrial Tech.), Shigeomi Koshimizu (Advanced Instit. of Indust. Tech)
 [more] US2015-79
pp.29-32
US 2012-12-18
13:45
Kanagawa Suzukakedai Campus, Tokyo Institute of Technology Basic study on cleaning of machine part using microbubble in ultrasonic field
Yuki Nakamura, Hiroshi Ikeda, Katsumi Kurita, Shigeru Aoki (TMCIT), Seiji Hirai, Makoto Kohmura (IT)
In this study, a new cleaning method of machine parts using tap water and microbubble in ultrasonic field(28 kHz, 100 W)... [more] US2012-81
pp.5-10
US 2010-12-16
16:45
Kanagawa Suzukakedai Campus, Tokyo Institute of Technology Reduction Method for Residual Stress on Welded Joint Using Ultrasonic and Low Frequency Vibrations -- Simulation Using Model with Plastic Deformation --
Shigeru Aoki, Tadashi Nishimura, Tetsumaro Hiroi, Katsumi Kurita (TMCIT), Seiji Hirai (IOT), Shigeomi Koshimizu (AIIT)
Welding is widely used for construction of many structures. Residual stress is generated near the bead because of locall... [more] US2010-91
pp.35-38
 Results 1 - 4 of 4  /   
Choose a download format for default settings. [NEW !!]
Text format pLaTeX format CSV format BibTeX format


[Return to Top Page]

[Return to IEICE Web Page]


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan