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Committee Date Time Place Paper Title / Authors Abstract Paper #
SDM 2021-02-05
Online Online [Invited Talk] Ru Area Selective Metal Capping and Wafer Surface Condition Control for sub-30nm Pitch Cu Damascene Interconnect
Hirokazu Aizawa, Kaoru Maekawa, Kai-Hung Yu, Gyana Pattanaik, Gert Leusink (TTCA) SDM2020-55
 [more] SDM2020-55
SDM 2020-02-07
Tokyo Tokyo University-Hongo [Invited Talk] Novel Volatile Film for Precise Dual Damascene Fabrication
Makoto Fujikawa, Tatsuya Yamaguchi (TTS), Yuki Kikuchi, Kaoru Maekawa (TTCA), Hiroaki Kawasaki, Yoji Iizuka (TEL) SDM2019-92
Abstract— Plasma induced damage on porous low-k dielectrics is a critical issue to lower the interconnect RC delay in th... [more] SDM2019-92
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