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Committee Date Time Place Paper Title / Authors Abstract Paper #
OPE, LQE 2014-12-19
Tokyo Kikai-Shinko-Kaikan, NTT Atsugi R&D center Optical transmission between III-V chips on Si by using photonic wire bonding
Gu Zhichen, Tomohiro Amemiya (Tokyo Tech.), Atsushi Ishikawa (RIKEN), Yuki Atsumi (AIST), Kang Junhyung, Takuo Hiratani, Yusuke Hayashi, Junichi Suzuki, Nobuhiko Nishiyama (Tokyo Tech.), Takuo Tanaka (RIKEN), Shigehisa Arai (Tokyo Tech.) OPE2014-143 LQE2014-130
In this paper, we present some design considerations and fabrication process of photonic wire bonding (PWB) based on two... [more] OPE2014-143 LQE2014-130
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