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Committee Date Time Place Paper Title / Authors Abstract Paper #
SDM 2024-02-21
10:05		 Tokyo Tokyo University-Hongo-Engineering Bldg.4
(Primary: On-site, Secondary: Online)		 [Invited Talk] Pre-treatment Study for Barrier-less Ruthenium Filling into Single Damascene via of Sub 20nm Hole
Ryota Yonezawa, Kai-Hung Yu, Hirokazu Aizawa, Hidenao Suzuki, Cory Wajda, Gert Leusink (TTCA) SDM2023-81		  [more] SDM2023-81
pp.1-3
SDM 2021-02-05
13:05		 Online Online [Invited Talk] Ru Area Selective Metal Capping and Wafer Surface Condition Control for sub-30nm Pitch Cu Damascene Interconnect
Hirokazu Aizawa, Kaoru Maekawa, Kai-Hung Yu, Gyana Pattanaik, Gert Leusink (TTCA) SDM2020-55		  [more] SDM2020-55
pp.1-6
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