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Committee Date Time Place Paper Title / Authors Abstract Paper #
SDM 2010-02-05
14:30
Tokyo Kikai-Shinko-Kaikan Bldg. Performance of Cu Dual-Damascene Interconnects Using a Thin Ti-Based Self-Formed Barrier Layer for 28-nm Node and Beyond
K. Ohmori, K. Mori, K. Maekawa (Renesas), Kazuyuki Kohama, Kazuhiro Ito (Kyoto Univ.), T. Ohnishi, M. Mizuno (KOBE STEEL), K. Asai (Renesas), M. Murakami (Ritsumeikan Trust), Hiroshi Miyatake (Renesas) SDM2009-188
With continuous shrinkage of advanced ULSIs, the impact of line resistance on the devices has become more and more serio... [more] SDM2009-188
pp.37-41
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