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Committee Date Time Place Paper Title / Authors Abstract Paper #
SDM, R, ED 2007-11-16
16:10		 Osaka   A New TDDB Degradation Model Based on Cu Ion Drift in Cu Interconnect Dielectrics
Naohito Suzumura, Shigehisa Yamamoto, , , Junko Komori, (Renesas Technology Corp.) R2007-53 ED2007-186 SDM2007-221		 A new physical model of Time-Dependent Dielectric Breakdown (TDDB) in Cu interconnect dielectrics is proposed. TDDB occu... [more] R2007-53 ED2007-186 SDM2007-221
pp.39-44
ICD, CPM 2005-01-27
14:00		 Tokyo Kikai-Shinko-Kaikan Bldg. High-resolution failure analysis with SIL plate
Takeshi Yoshida, Thoru Koyama, Junko Komori, Yoji Mashiko (Renesas) 		 [more] CPM2004-157 ICD2004-202
pp.13-17
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