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All Technical Committee Conferences (Searched in: All Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
EMCJ (2nd) |
2010-05-28 16:15 |
Miyagi |
Cyberscience Center, Tohoku University |
A conductive noise filter in PCB using a λ/4 resonance plate Jun Sakai, Kouichirou Nakase, Eiji Hankui (NEC) |
[more] |
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OME |
2009-10-23 15:05 |
Osaka |
Chuo-Denki-Club, ROOM 213 |
Molecular Orientation Control in Poly(3-hexylthiophene):[60]PCBM Bulk Heterojunction Organic Solar Cells
-- The Effect of P3HT Molecular Weight and Drying Process on Blend Morphology -- Jun Sakai, Tetsurou Hori, Akihiko Fujii, Masanori Ozaki (Osaka Univ.) OME2009-49 |
[more] |
OME2009-49 pp.47-52 |
OME |
2008-09-30 15:55 |
Hyogo |
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Fundamental Property of Poly (3-hexylthiophene) / C60 Interpenetrating Heterojunction Organic Thin-Film Solar Cells and the Effect of the Insertion of MoO3 Cathode Buffer Layer Tetsuro Hori, Takeshi Shibata, Varutt Kittichungchit (Osaka Univ.), Xiaouhui Ju (Osaka Univ./Tianjin Univ.), Jun Sakai (Osaka Univ./MATSUSHITA ELECTRIC WORKS), Hitoshi Kubo, Akihiko Fujii, Masanori Ozaki (Osaka Univ.) OME2008-48 |
Improvement of photovoltaic properties of a photovoltaic cell with a hetero-junction of poly (3-hexyl- thiophene) / C60 ... [more] |
OME2008-48 pp.27-32 |
CPM, ICD |
2008-01-18 13:50 |
Tokyo |
Kikai-Shinko-Kaikan Bldg |
A Package-on-Package using Coreless Substrate with Excellent Power Integrity Kentaro Mori, Jun Sakai, Katsumi Kikuchi, Shinji Watanabe, Tomoo Murakami, Shintaro Yamamichi (NEC) CPM2007-143 ICD2007-154 |
(To be available after the conference date) [more] |
CPM2007-143 ICD2007-154 pp.87-92 |
ICD, CPM |
2005-09-08 09:00 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
The comparison of electrical characteristics of FCBGA packaging substrate based on MLTS and conventional build-up PWB Jun Sakai, Koichiro Nakase (NEC), Hirokazu Honda (NECエレクトロニクス), Hirobumi Inoue (NEC) |
We heve developed an ultra-thin high-density packaging substrate, called an MLTS (multi-layer thin substrate), that cons... [more] |
CPM2005-85 ICD2005-95 pp.1-6 |
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