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All Technical Committee Conferences (Searched in: All Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
ICD, SDM, ITE-IST [detail] |
2022-08-08 15:20 |
Online |
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Evaluation of IC Chip Response by Backside Voltage Disturbance in Flip Chip Packaging Takuya Wadatsumi, Kohei Kawai, Rikuu Hasegawa (Kobe Univ.), Kikuo Muramatsu (e-SYNC), Hiromu Hasegawa, Takuya Sawada, Takahito Fukushima, Hisashi Kondo (Megachips), Takuji Miki, Makoto Nagata (Kobe Univ.) SDM2022-40 ICD2022-8 |
Flip chip packaging has become a general technique for mounting semiconductor ICs due to the need for smaller area. Howe... [more] |
SDM2022-40 ICD2022-8 pp.27-30 |
IE, IPSJ-AVM, CS, ITE-BCT |
2007-12-14 11:15 |
Aichi |
Nagoya Univ. |
Considerations and experiments for stable ship mobile reception of Terrestrial Digital TV waves Kazuhisa Haeiwa (Hiroshima City Univ.), Hisashi Kondo (RCC), Shozo Iwaki, Takashi Kotani, Taiichiro Ueta (ITeck) CS2007-45 IE2007-128 |
We studied and investigated to realize stable reception of digital TV waves and re-transmission technology at ships conn... [more] |
CS2007-45 IE2007-128 pp.95-100 |
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