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All Technical Committee Conferences (Searched in: All Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
SDM |
2011-02-07 10:50 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Path-finding for Integration of Robust Low-k (k-2.5) SiOCH in System LSI Naoya Inoue, Makoto Ueki, Hironori Yamamoto, Ippei Kume, Jun Kawahara, Manabu Iguchi, Hirokazu Honda, Yoshitaka Horikoshi, Yoshihiro Hayashi (Renesas Electronics Corp.) SDM2010-217 |
Impacts of k-value reduction on LSI performances are clarified quantitatively using 2M-gate net-list. Reduction in k-val... [more] |
SDM2010-217 pp.7-12 |
ICD, CPM |
2005-09-08 09:00 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
The comparison of electrical characteristics of FCBGA packaging substrate based on MLTS and conventional build-up PWB Jun Sakai, Koichiro Nakase (NEC), Hirokazu Honda (NECエレクトロニクス), Hirobumi Inoue (NEC) |
We heve developed an ultra-thin high-density packaging substrate, called an MLTS (multi-layer thin substrate), that cons... [more] |
CPM2005-85 ICD2005-95 pp.1-6 |
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