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All Technical Committee Conferences (Searched in: All Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
SDM |
2014-01-29 15:30 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
[Invited Talk]
3D Integrated CMOS Device by Using Wafer Stacking and Via-last TSV Mayu Aoki, Futoshi Furuta, Kazuyuki Hozawa, Yuko Hanaoka, Kenichi Takeda (Hitachi) SDM2013-145 |
A three-layer-stacked wafer with CMOS devices was fabricated for the first time by using hybrid wafer bonding and backsi... [more] |
SDM2013-145 pp.43-46 |
VLD, DC, IPSJ-SLDM, CPSY, RECONF, ICD, CPM (Joint) [detail] |
2013-11-27 14:00 |
Kagoshima |
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[Invited Talk]
Circuit design for 3D-stacking using TSV interconnects Kenichi Osada, Futoshi Furuta, Kenichi Takeda (Hitachi) VLD2013-73 CPM2013-117 ICD2013-94 CPSY2013-58 DC2013-39 RECONF2013-41 |
To improve the performance of 3D-stacking using TSV interconnects, circuit techniques were developed. To improve Z-axis ... [more] |
VLD2013-73 CPM2013-117 ICD2013-94 CPSY2013-58 DC2013-39 RECONF2013-41 pp.93-96(VLD), pp.55-58(CPM), pp.55-58(ICD), pp.1-4(CPSY), pp.93-96(DC), pp.13-16(RECONF) |
SCE |
2007-10-17 14:55 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Study of stack-type AC driver for SFQ circuit Nozomu Kato (TDU), Hideo Suzuki, Hiroshi Takai (SRL), Futoshi Furuta, Keiichi Tanabe (TDU) |
[more] |
SCE2007-22 pp.23-27 |
SCE |
2005-07-27 11:10 |
Aomori |
Hirosaki Univ. |
Design and simulation of high temperature superconductive Single-Flux-Quantum circuit on ground plane Kazuo Saitoh, Futoshi Furuta (ARL Hitachi) |
To achieve high-speed operation of high-temperature superconductive single-flux-quantum (SFQ) circuit, we designed two b... [more] |
SCE2005-16 pp.21-26 |
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