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Committee Date Time Place Paper Title / Authors Abstract Paper #
SDM 2014-02-28
Tokyo Kikai-Shinko-Kaikan Bldg. [Invited Talk] 15μm-pitch Bump Interconnections Relied on Flip-chip Bonding Technique -- for Advanced Chip Stacking Applications --
Masahiro Aoyagi, Thanh-Tung Bui, Fumiki Kato, Naoya Watanabe, Shunsuke Nemoto, Katsuya Kikuchi (AIST) SDM2013-173
This paper reports the development of reliable fine-pitch micro-bump Cu/Au interconnections relied on a high-precision r... [more] SDM2013-173
ICD, SDM 2012-08-02
Hokkaido Sapporo Center for Gender Equality, Sapporo, Hokkaido 3D Interconnect Technology by the Ultrawide-Interchip-Bus System for 3D Stacked LSI Systems
Fumito Imura, Shunsuke Nemoto, Naoya Watanabe, Fumiki Kato, Katsuya Kikuchi, Hiroshi Nakagawa (AIST), Michiya Hagimoto, Hiroyuki Uchida, Takashi Omori, Yasumori Hibi, Yukoh Matsumoto (TOPS Systems), Masahiro Aoyagi (AIST) SDM2012-71 ICD2012-39
We have proposed the ultrawide-interchip-bus system for the interchip communication of the 3-dimentional stacked LSI sys... [more] SDM2012-71 ICD2012-39
Miyagi   Fabrication of Blazed Gratings by SR Exposure System
Tomohiko Kanie, Makoto Katayama (SEI), Teppei Morita, Noboru Toshima, Junichi Kato (Nakanuma ASC), Tomio Nagayama, Yasushi Mizutani (KMIR), Fumiki Kato, Shinya Fujinawa, Susumu Sugiyama (Rits) OFT2006-17
We have successively fabricated a blazed nano grating based on the X-ray gray-scale lithography technology.
The structu... [more]
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