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All Technical Committee Conferences (Searched in: All Years)
| Committee | Date Time | Place | Paper Title / Authors | Abstract | Paper # | |
| CPM | 2023-07-31 17:00 |
Hokkaido | (Primary: On-site, Secondary: Online) |
[Invited Talk]
Progress and future perspective of room-temperature bonding technologies for heterogeneous integration Eiji Higurashi, Kai Takeuchi (Tohoku Univ.)  CPM2023-17 |
In recent years, bonding technology has attracted much attention and has become increasingly important to realize high-p... [more] | CPM2023-17 pp.21-24 |
| VLD, DC, CPSY, RECONF, ICD, IE, IPSJ-SLDM, IPSJ-EMB, IPSJ-ARC (Joint) [detail] |
2019-11-15 14:15 |
Ehime | Ehime Prefecture Gender Equality Center | Triple-Layered Ring Oscillators and Image Sensors Developed by Direct Bonding of SOI Wafers Masahide Goto (NHK), Yuki Honda (NHK-ES), Toshihisa Watabe, Kei Hagiwara, Masakazu Nanba, Yoshinori Iguchi (NHK), Takuya Saraya, Masaharu Kobayashi (Univ. of Tokyo), Eiji Higurashi (AIST), Hiroshi Toshiyoshi, Toshiro Hiramoto (Univ. of Tokyo) ICD2019-38 IE2019-44 |
We have studied on pixel-parallel three-dimensional (3D) integrated CMOS image sensors. We previously reported double-la... [more] | ICD2019-38 IE2019-44 pp.45-49 |
| SDM | 2019-02-07 16:10 |
Tokyo | [Invited Talk]
Fabrication of substrates with smooth Au surface for bonding at room temperature in atmospheric air Takashi Matsumae, Michitaka Yamamoto, Yuichi Kurashima, Eiji Higurashi, Hideki Takagi (AIST) SDM2018-97 |
e electroformed a Cu-based heat spreader with smooth Au thin film for room temperature bonding in atmospheric air. The C... [more] | SDM2018-97 pp.27-30 |
|
| VLD, DC, CPSY, RECONF, CPM, ICD, IE, IPSJ-SLDM, IPSJ-EMB, IPSJ-ARC (Joint) [detail] |
2018-12-07 15:15 |
Hiroshima | Satellite Campus Hiroshima | Quarter Video Graphics Array Image Sensor with Linear and Wide-Dynamic-Range Output Developed by Pixel-Wise 3D Integration Masahide Goto, Yuki Honda, Toshihisa Watabe, Kei Hagiwara, Masakazu Nanba, Yoshinori Iguchi (NHK), Takuya Saraya, Masaharu Kobayashi, Eiji Higurashi, Hiroshi Toshiyoshi, Toshiro Hiramoto (Univ. of Tokyo) CPM2018-97 ICD2018-58 IE2018-76 |
We report on pixel-parallel three-dimensional (3D) integrated CMOS image sensors. Photodiodes (PDs), pulse generation ci... [more] | CPM2018-97 ICD2018-58 IE2018-76 pp.43-48 |
| SDM | 2015-01-27 14:25 |
Tokyo | Kikai-Shinko-Kaikan Bldg. | [Invited Talk]
Three-Dimensional Integrated CMOS Image Sensors with Pixel-Parallel A/D Converters Fabricated by Direct Bonding of SOI Layers Masahide Goto, Kei Hagiwara, Yoshinori Iguchi, Hiroshi Ohtake (NHK), Takuya Saraya, Masaharu Kobayashi, Eiji Higurashi, Hiroshi Toshiyoshi, Toshiro Hiramoto (The Univ. of Tokyo) SDM2014-141 |
We report the first demonstration of three-dimensional (3D) integrated CMOS image sensors with pixel-parallel A/D conver... [more] | SDM2014-141 pp.25-28 |
| ED, LQE, CPM | 2012-11-29 10:00 |
Osaka | Osaka City University | Electrical Properties of Si-Based Heterojunctions by Surface-Activated Bonding Jianbo Liang, Naoteru Shigekawa (Osaka City Univ.), Eiji Higurashi (Univ. Tokyo) ED2012-65 CPM2012-122 LQE2012-93 |
[more] | ED2012-65 CPM2012-122 LQE2012-93 pp.1-5 |
| PN, OPE, EMT, LQE | 2009-01-29 09:45 |
Kyoto | Kyoto Institute Technology (Matsugasaki Campus) | Characteristics of InGaAsP/InP semiconductor laser chips on Si substrates bonded at low temperature in ambient air Ryo Takigawa, Eiji Higurashi, Tadatomo Suga (The Univ. of Tokyo), Renshi Sawada (Kyushu Univ.) |
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