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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
 Results 1 - 9 of 9  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
ICD, SDM, ITE-IST [detail] 2020-08-06
13:50
Online Online Over-the-top Si Interposer Embedding Backside Buried Metal to Reduce Power Supply Impedance
Takuji Miki, Makoto Nagata, Akihiro Tsukioka (Kobe Univ.), Noriyuki Miura (Osaka Univ.), Takaaki Okidono (ECSEC), Yuuki Araga, Naoya Watanabe, Haruo Shimamoto, Katsuya Kikuchi (AIST) SDM2020-5 ICD2020-5
A 2.5D structure with a Si interposer stacked on a CMOS chip is developed to reduce power supply impedance. A backside b... [more] SDM2020-5 ICD2020-5
pp.19-24
HWS, VLD [detail] 2020-03-07
13:25
Okinawa Okinawa Ken Seinen Kaikan Side-channel leakage evaluation of cryptographic module by IC chip level power supply noise simulation
Kazuki Yasuda, Kazuki Monta, Akihiro Tsukioka, Noriyuki Miura, Makoto Nagata (Kobe Univ), Karthik Srinivasan, Shan Wan, Lagn Lin, Ying-Shiun Li, Norman Chang (ANSYS) VLD2019-142 HWS2019-115
In this research, we focused on power supply noise as one of the observed side channel information leakage in cryptograp... [more] VLD2019-142 HWS2019-115
pp.279-282
HWS, ICD [detail] 2019-11-01
14:55
Osaka DNP Namba SS Bld. Countermeasures for power noise and side-channel leakage in crypto modules (Ⅱ)
Kazuki Monta, Akihiro Tsukioka, Daichi Nakagawa, Kazuki Yasuoka, Noriyuki Miura, Makoto Nagata (Kobe Univ.), Karthik Srinivasan, Shan Wan, Lang Lin, Ying-Siun Li, Norman Chang (ANSYS) HWS2019-61 ICD2019-22
 [more] HWS2019-61 ICD2019-22
pp.25-28
ISEC, SITE, ICSS, EMM, HWS, BioX, IPSJ-CSEC, IPSJ-SPT [detail] 2019-07-23
13:35
Kochi Kochi University of Technology Side-channel leakage evaluation of cryptographic module by IC chip level consumption simulation
Kazuki Yasuda, Kazuki Monta, Akihiro Tsukioka, Noriyuki Miura, Makoto Nagata (Kobe Univ.) ISEC2019-27 SITE2019-21 BioX2019-19 HWS2019-22 ICSS2019-25 EMM2019-30
With the development of the information society, side-channel information leakage due to power supply noise in a cryptog... [more] ISEC2019-27 SITE2019-21 BioX2019-19 HWS2019-22 ICSS2019-25 EMM2019-30
pp.139-143
ICD, CPSY, CAS 2018-12-23
09:30
Okinawa   [Poster Presentation] Evaluation of side-channel leakage in crypto modules with On-Chip-Monitor
Kazuki Monta, Hiroki Sonoda, Akihiro Tsukioka (Kobe Univ.), Takaaki Okidono (ECSEC), Takuji Miki, Noriyuki Miura, Makoto Nagata (Kobe Univ.) CAS2018-103 ICD2018-87 CPSY2018-69
 [more] CAS2018-103 ICD2018-87 CPSY2018-69
p.101
VLD, DC, CPSY, RECONF, CPM, ICD, IE, IPSJ-SLDM, IPSJ-EMB, IPSJ-ARC
(Joint) [detail]
2018-12-07
14:35
Hiroshima Satellite Campus Hiroshima Analysis of Conductive Power Noise Characteristics in Digital IC Chips between two Different IC Packaging Structures
Akihiro Tsukioka, Kosuke Jike, Koh Watanabe, Noriyuki Miura, Makoto Nagata (Kobe Univ.) CPM2018-96 ICD2018-57 IE2018-75
The conducted and radiated emission are caused by the dynamic power consumption in digital circuit operations. The chara... [more] CPM2018-96 ICD2018-57 IE2018-75
pp.37-42
HWS, ICD 2018-10-29
13:25
Osaka Kobe Univ. Umeda Intelligent Laboratory Countermeasures for power noise and side-channel leakage in crypto fmodules (I)
Kazuki Monta, Sousuke Sato, Akihiro Tsukioka (Kobe Univ.), Takaaki Okidono (ECSEC), Takuji Miki, Noriyuki Miura, Makoto Nagata (Kobe Univ.) HWS2018-48 ICD2018-40
 [more] HWS2018-48 ICD2018-40
pp.7-11
SDM, ICD, ITE-IST [detail] 2018-08-08
12:50
Hokkaido Hokkaido Univ., Graduate School of IST M Bldg., M151 Measurements and Analysis of Power Supply Noise in Digital IC Chip
Kosuke Jike, Akihiro Tsukioka, Ryohei Sawada, Koh Watanabe, Noriyuki Miura, Makoto Nagata (Kobe Univ) SDM2018-39 ICD2018-26
Dynamic power noise can be the root cause of electromagnetic compatibility (EMC) problems of electromagnetic interferenc... [more] SDM2018-39 ICD2018-26
pp.77-82
VLD, DC, CPSY, RECONF, CPM, ICD, IE, IPSJ-SLDM, IPSJ-EMB, IPSJ-ARC
(Joint) [detail]
2017-11-07
14:55
Kumamoto Kumamoto-Kenminkouryukan Parea Simulation Techniques for EMC Compliant Design of Automotive IC Chips and Modules
Akihiro Tsukioka, Makoto Nagata, Kohki Taniguchi, Daisuke Fujimoto (Kobe Univ.), Rieko Akimoto, Takao Egami, Kenji Niinomi, Takeshi Yuhara, Sachio Hayashi (TOSHIBA), Rob Mathews, Karthik Srinivasan, Ying-Shiun Li, Norman Chang (ANSYS) CPM2017-84 ICD2017-43 IE2017-69
In recent years, electromagnetic compatibility (EMC) becomes a major concern among IC chips. EMC is characterized in two... [more] CPM2017-84 ICD2017-43 IE2017-69
pp.27-32
 Results 1 - 9 of 9  /   
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