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All Technical Committee Conferences (Searched in: All Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
ICD, SDM |
2009-07-16 15:50 |
Tokyo |
Tokyo Institute of Technology |
The Study of Mobility-Tinv Trade-off in Deeply Scaled High-k/Metal Gate Devices and Scaling Design Guideline for 22nm-node Generation Masakazu Goto, Shigeru Kawanaka, Seiji Inumiya, Naoki Kusunoki, Masumi Saitoh, Kosuke Tatsumura, Atsuhiro Kinoshita, Satoshi Inaba, Yoshiaki Toyoshima (Toshiba) SDM2009-107 ICD2009-23 |
The trade-off between Tinv scaling and carrier mobility () degradation in deeply scaled HK/MG nMOSFETs has been ... [more] |
SDM2009-107 ICD2009-23 pp.53-56 |
ICD, ITE-IST |
2008-10-23 11:10 |
Hokkaido |
Hokkaido University |
[Invited Talk]
Analog/RF performance of scaled MOSFET
-- Is scaled MOSFET friend for analog/RF circuits? -- Tatsuya Ohguro (Toshiba) ICD2008-74 |
High performance has been realized by gate length scaling of MOSFET. Recently, not only gate length scaling but also ag... [more] |
ICD2008-74 pp.89-94 |
ICD, CPM |
2005-09-09 10:55 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Lead-free bumping and its process integrity for fine pitch interconnects Hirokazu Ezawa, Masaharu Seto, Kazuhito Higuchi (Toshiba) |
Electroplated solder bumps allow much finer pitch interconnection for high I/O applications, although controlling the al... [more] |
CPM2005-99 ICD2005-109 pp.17-22 |
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