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All Technical Committee Conferences (Searched in: All Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
US |
2014-05-26 15:50 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Development and consideration on applicability of culture flask for brain tumor cells with acoustic window film for ultrasound exposure Sakino Iwashiro (Toin Yokohama Univ.), Akiko Watanabe (Fukuoka Univ.), Yoshifumi Onozuka (Seidensha Electronics), Masatsune Minai, Hiroyuki Nishimura, Shinichi Takeuchi (Toin Yokohama Univ.) US2014-13 |
[more] |
US2014-13 pp.31-36 |
US |
2009-12-18 15:50 |
Kanagawa |
Suzukakedai Campus, Tokyo Institute of Technology |
Examination of an in-plane complex-mode vibration system using two natural frequency Yuji Watanabe (Takusyoku Univ.), Kazuyuki Yoneya, Kengo Naruse (Seidensha Electronics Co., ltd) US2009-85 |
We studied on a new type of ultrasonic welding tool for joining thin films. The tool is a resonator which is driven by t... [more] |
US2009-85 pp.31-34 |
US |
2007-12-13 15:45 |
Kanagawa |
Tokyo Inst. of Tech. (Suzukake-dai) |
Ultrasonic Plastic Welding at 2.5MHz using a Surface Acoustic Wave Device Kengo Naruse (Seidensha), Kiyomi Mori, Yuji Watanabe (Takushoku Univ.) US2007-87 |
We are carrying out ultrasonic plastic welding by using a surface acoustic wave (SAW) device. The advantage of usage of ... [more] |
US2007-87 pp.29-34 |
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