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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
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Committee Date Time Place Paper Title / Authors Abstract Paper #
SIP, CAS, VLD, MSS 2021-07-05
16:25		 Online Online Thermal Comfort Aware Real-time Co-scheduling of HVAC, Battery System, and Smart Appliances for Smart Building
Daichi Watari, Ittetsu Taniguchi (Osaka Univ.), Francky Catthoor (IMEC/KUL), Charalampos Marantos (NTUA), Kostas Siozios (AUTH), Elham Shirazi (IMEC/KUL), Dimitrios Soudris (NTUA), Takao Onoye (Osaka Univ.) CAS2021-8 VLD2021-8 SIP2021-18 MSS2021-8		 Building energy management is vital for reducing electricity costs and maximizing occupant comfort. This paper proposes ... [more] CAS2021-8 VLD2021-8 SIP2021-18 MSS2021-8
pp.36-41
SDM 2020-02-07
10:10		 Tokyo Tokyo University-Hongo [Invited Talk] Stability of Cu Interconnect Surface after post CMP Cleaning
Yasuhiro Kawase, Toshiaki Shibata, Tomohiro Kusano (MCC), Ken Harada (imec), Kan Takeshita (MCC) SDM2019-90		 At present, more than 12 Cu interconnect layers have been formed in advanced semiconductor devices and each layer is pla... [more] SDM2019-90
pp.9-14
VLD, DC, CPSY, RECONF, CPM, ICD, IE
(Joint) [detail]		 2016-11-28
15:30		 Osaka Ritsumeikan University, Osaka Ibaraki Campus Circuit Simulation Method Using Bimodal Defect-Centric Model of Random Telegraph Noise on 40 nm SiON Process
Michitarou Yabuuchi, Azusa Oshima, Takuya Komawaki, Kazutoshi Kobayashi, Ryo Kishida, Jun Furuta (KIT), Pieter Weckx (KUL/IMEC), Ben Kaczer (IMEC), Takashi Matsumoto (Univ. of Tokyo), Hidetoshi Onodera (Kyoto Univ.) VLD2016-52 DC2016-46		 We propose a circuit analysis method using the bimodal RTN (random telegraph
noise) model of the defect-centric distri... [more]		 VLD2016-52 DC2016-46
pp.49-54
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