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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
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Committee Date Time Place Paper Title / Authors Abstract Paper #
SDM, ICD, ITE-IST [detail] 2019-08-07
15:35		 Hokkaido Hokkaido Univ., Graduate School /Faculty of Information Science and [Invited Talk] Ultrafast Photonics Packaging using Room Temperature Bonding
Ryo Takigawa (Kyushu Univ.) 		 [more]
MWP 2017-11-09
14:05		 Tokyo Kikai-Shinko-Kaikan Bldg. [Invited Talk] Packaging of LiNbO3 optical device by low-temperature Au-Au bonding in ambient air
Ryo Takigawa (Kyushu Univ.) MWP2017-46		 As an alternative to conventional AuSn solder bonding, we have developed low-temperature solid-state bonding method of A... [more] MWP2017-46
pp.7-11
PN, OPE, EMT, LQE 2009-01-29
09:45		 Kyoto Kyoto Institute Technology (Matsugasaki Campus) Characteristics of InGaAsP/InP semiconductor laser chips on Si substrates bonded at low temperature in ambient air
Ryo Takigawa, Eiji Higurashi, Tadatomo Suga (The Univ. of Tokyo), Renshi Sawada (Kyushu Univ.) 		 [more]
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