Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
ICD, CPM |
2005-09-08 09:00 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
The comparison of electrical characteristics of FCBGA packaging substrate based on MLTS and conventional build-up PWB Jun Sakai, Koichiro Nakase (NEC), Hirokazu Honda (NECエレクトロニクス), Hirobumi Inoue (NEC) |
We heve developed an ultra-thin high-density packaging substrate, called an MLTS (multi-layer thin substrate), that cons... [more] |
CPM2005-85 ICD2005-95 pp.1-6 |
ICD, CPM |
2005-09-08 09:25 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Characteristic dielectric constant for polyimide thin films at 10GHz Shigemasa Segawa (PI R&D), Sachiko Ito, Katsuya Kikuchi, Kazuhiko Tokoro, Hiroshi Nakagawa, Masahiro Aoyagi (AIST) |
[more] |
CPM2005-86 ICD2005-96 pp.7-12 |
ICD, CPM |
2005-09-08 09:50 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Development of Design Techniques for Semiconductor-Package By using Simplified DRAM Macro Model of Power System Satoshi Nakamura, Takashi Suga (Hitachi PERL), Mitsuaki Katagiri, Yoji Nishio, Seiji Funaba, Yukitoshi Hirose, イサ サトシ (Elpida) |
In late years, MCP(Multi Chip Package) and SiP(System in Package) which has plural semiconductor chips in one package be... [more] |
CPM2005-87 ICD2005-97 pp.13-18 |
ICD, CPM |
2005-09-08 10:30 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Performance evaluation of high-precision manipulator for probing on entire chip surface Akira Nakada, Keijiro Itakura, Hiroshi Kubota (Kumamoto Univ.) |
[more] |
|
ICD, CPM |
2005-09-08 10:55 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Visualization of High Frequency Electromagnetic Field over Fine Circuits by Magnetooptic/Electrooptic Probe Mizuki Iwanami, Shigeki Hoshino, Norio Masuda (NEC), Masato Kishi (Univ. of Tokyo), Masahiro Tsuchiya (NICT) |
To realize a electromagnetic field probe that is capable of contributing to an electrical design, especially a low-noise... [more] |
CPM2005-88 ICD2005-98 pp.19-24 |
ICD, CPM |
2005-09-08 11:20 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Diagnostic Test Compaction for Combinational and Sequential Circuits Yoshinobu Higami (Ehime Univ.), Kewal K Saluja (Univ. of Wisconsin), Hiroshi Takahashi, Shin-ya Kobayashi, Yuzo Takamatsu (Ehime Univ.) |
Recently, it is getting important to reduce the cost of test and fault diagnosis.
Since the cost of test and fault diag... [more] |
CPM2005-89 ICD2005-99 pp.25-30 |
ICD, CPM |
2005-09-08 13:00 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
System Packaging Issue and Solution of Renesas SiP Noriaki Sakamoto, Norihiko Sugita, Takafumi Kikuchi, Hideki Tanaka, Takashi Akazawa (ルネサステクノロジ) |
[more] |
CPM2005-90 ICD2005-100 pp.31-34 |
ICD, CPM |
2005-09-08 13:25 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Basic Study of Proper Circuit Line Structure for Advanced System in Package Shouhei Yasuda (Melco Display Tech.), Yoshiharu Iwata, Ryohei Satoh (Osaka Univ.) |
Although the semiconductor has raised performance by speeding up of the clock frequency and shrinking the process rule, ... [more] |
CPM2005-91 ICD2005-101 pp.35-40 |
ICD, CPM |
2005-09-08 13:50 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
The Study of Silicon Stress for Stacked Die Packages Kenji Abe, Eiichi Yamada, Yutaka Suzuki, Masazumi Amagai (TI Japan) |
[more] |
CPM2005-92 ICD2005-102 pp.41-44 |
ICD, CPM |
2005-09-08 14:30 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
The Study of Stress Sensor for Stacked Die Packages Yutaka Suzuki, Kenji Abe, Eiichi Yamada, , Masazumi Amagai (TI Japan) |
[more] |
CPM2005-93 ICD2005-103 pp.45-48 |
ICD, CPM |
2005-09-08 14:55 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Design and fabrication of MOS devices patterning with LCD image projection Akira Nakada, Satoshi Wakimoto, Hiroshi Kubota (Kumamoto Univ.) |
[more] |
|
ICD, CPM |
2005-09-08 15:20 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
2 GHz Linear Amplifier Module with Feedforward Linearizer Hiroyuki Kayano (Toshiba), Yuji Ohtsuka, Masao Suzuki, Masaya Ishiguro (TDMS), Tatsunori Hashimoto (Toshiba) |
A feedforward linearizer amplifier module on a substrate we have developed is described. In particular, we report the ad... [more] |
CPM2005-94 ICD2005-104 pp.49-52 |
ICD, CPM |
2005-09-08 15:45 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
A CMOS Impulse Radio Ultra-Wideband Transceiver for 1Mb/s Data Communications and ±2.5cm Range Findings Takahide Terada, Shingo Yoshizumi, Muhammad Muqsith, Yukitoshi Sanada, Tadahiro Kuroda (Keio Univ.) |
[more] |
CPM2005-95 ICD2005-105 pp.53-58 |
ICD, CPM |
2005-09-09 09:00 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
[Invited Talk]
The study of the high frequency electrical characteristics in high-speed digital device mounting Chihiro Ueda (AETJAPAN) |
[more] |
CPM2005-96 ICD2005-106 pp.1-5 |
ICD, CPM |
2005-09-09 09:50 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Analysis of Transmission Characteristic of High-speed Differential Sgnal Bus Tsuyoshi Tokiwa, Toshio Sudo (Toshiba), Nobuhiro Tsuruta (Toshiba DME), Yoshihiro Nishida (Toshiba DM) |
With performance improvement of CPU, improvement of signal transmission ability between LSI became indispensable. And th... [more] |
CPM2005-97 ICD2005-107 pp.7-12 |
ICD, CPM |
2005-09-09 10:15 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Measuemnt and Discussion of Degradation of Pulse Feature according with Line Length Increase Koichi Yabuuchi (EMtech), Tamotsu Usami, Yutaka Akiyama, Kanji Otsuka (Meisei Univ.) |
In this research, the single pulse (1kHz, 100kHz, 10MHz, 100MHz, and 500MHz) was inputted into coaxial cables 1m, 10m, a... [more] |
CPM2005-98 ICD2005-108 pp.13-16 |
ICD, CPM |
2005-09-09 10:55 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Lead-free bumping and its process integrity for fine pitch interconnects Hirokazu Ezawa, Masaharu Seto, Kazuhito Higuchi (Toshiba) |
Electroplated solder bumps allow much finer pitch interconnection for high I/O applications, although controlling the al... [more] |
CPM2005-99 ICD2005-109 pp.17-22 |
ICD, CPM |
2005-09-09 11:20 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Development of New Surface Finish Technology for Package Substrates with Excellent Bondability Kiyotaka Tsukada (IBIDEN) |
This Paper describes the characteristics, development, and application of
the surface finish technologies for chip pack... [more] |
CPM2005-100 ICD2005-110 pp.23-27 |
ICD, CPM |
2005-09-09 13:00 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Simultaneous switching noise(SSN) and EMI of a semiconductor package Takanobu Kushihira (MSC), Toshio Sudo (TSB) |
We tested a series about a Simultaneous Switching Noise(SSN) by influence of the parasitism inductance that a package ha... [more] |
CPM2005-101 ICD2005-111 pp.29-34 |
ICD, CPM |
2005-09-09 13:25 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Study of 6Gbps Operation on 0.18um Node CMOS I/O Inverter with Transmission Structure in Signal and Power Distribution Lines Yutaka Akiyama (Meisei Univ.), Tsuneo Ito (Excel Service), Kyouji Ito (Renesas NJS), Kanji Otsuka (Meisei Univ.) |
This research acheeved measurement of the design which made transmission wiring for input and output to the 0.18um node ... [more] |
CPM2005-102 ICD2005-112 pp.35-40 |