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Technical Committee on Component Parts and Materials (CPM)  (Searched in: 2005)

Search Results: Keywords 'from:2005-09-08 to:2005-09-08'

[Go to Official CPM Homepage (Japanese)] 
Search Results: Conference Papers
 Conference Papers (Available on Advance Programs)  (Sort by: Date Ascending)
 Results 1 - 20 of 22  /  [Next]  
Committee Date Time Place Paper Title / Authors Abstract Paper #
ICD, CPM 2005-09-08
09:00
Tokyo Kikai-Shinko-Kaikan Bldg. The comparison of electrical characteristics of FCBGA packaging substrate based on MLTS and conventional build-up PWB
Jun Sakai, Koichiro Nakase (NEC), Hirokazu Honda (NECエレクトロニクス), Hirobumi Inoue (NEC)
We heve developed an ultra-thin high-density packaging substrate, called an MLTS (multi-layer thin substrate), that cons... [more] CPM2005-85 ICD2005-95
pp.1-6
ICD, CPM 2005-09-08
09:25
Tokyo Kikai-Shinko-Kaikan Bldg. Characteristic dielectric constant for polyimide thin films at 10GHz
Shigemasa Segawa (PI R&D), Sachiko Ito, Katsuya Kikuchi, Kazuhiko Tokoro, Hiroshi Nakagawa, Masahiro Aoyagi (AIST)
 [more] CPM2005-86 ICD2005-96
pp.7-12
ICD, CPM 2005-09-08
09:50
Tokyo Kikai-Shinko-Kaikan Bldg. Development of Design Techniques for Semiconductor-Package By using Simplified DRAM Macro Model of Power System
Satoshi Nakamura, Takashi Suga (Hitachi PERL), Mitsuaki Katagiri, Yoji Nishio, Seiji Funaba, Yukitoshi Hirose, イサ サトシ (Elpida)
In late years, MCP(Multi Chip Package) and SiP(System in Package) which has plural semiconductor chips in one package be... [more] CPM2005-87 ICD2005-97
pp.13-18
ICD, CPM 2005-09-08
10:30
Tokyo Kikai-Shinko-Kaikan Bldg. Performance evaluation of high-precision manipulator for probing on entire chip surface
Akira Nakada, Keijiro Itakura, Hiroshi Kubota (Kumamoto Univ.)
 [more]
ICD, CPM 2005-09-08
10:55
Tokyo Kikai-Shinko-Kaikan Bldg. Visualization of High Frequency Electromagnetic Field over Fine Circuits by Magnetooptic/Electrooptic Probe
Mizuki Iwanami, Shigeki Hoshino, Norio Masuda (NEC), Masato Kishi (Univ. of Tokyo), Masahiro Tsuchiya (NICT)
To realize a electromagnetic field probe that is capable of contributing to an electrical design, especially a low-noise... [more] CPM2005-88 ICD2005-98
pp.19-24
ICD, CPM 2005-09-08
11:20
Tokyo Kikai-Shinko-Kaikan Bldg. Diagnostic Test Compaction for Combinational and Sequential Circuits
Yoshinobu Higami (Ehime Univ.), Kewal K Saluja (Univ. of Wisconsin), Hiroshi Takahashi, Shin-ya Kobayashi, Yuzo Takamatsu (Ehime Univ.)
Recently, it is getting important to reduce the cost of test and fault diagnosis.
Since the cost of test and fault diag... [more]
CPM2005-89 ICD2005-99
pp.25-30
ICD, CPM 2005-09-08
13:00
Tokyo Kikai-Shinko-Kaikan Bldg. System Packaging Issue and Solution of Renesas SiP
Noriaki Sakamoto, Norihiko Sugita, Takafumi Kikuchi, Hideki Tanaka, Takashi Akazawa (ルネサステクノロジ)
 [more] CPM2005-90 ICD2005-100
pp.31-34
ICD, CPM 2005-09-08
13:25
Tokyo Kikai-Shinko-Kaikan Bldg. Basic Study of Proper Circuit Line Structure for Advanced System in Package
Shouhei Yasuda (Melco Display Tech.), Yoshiharu Iwata, Ryohei Satoh (Osaka Univ.)
Although the semiconductor has raised performance by speeding up of the clock frequency and shrinking the process rule, ... [more] CPM2005-91 ICD2005-101
pp.35-40
ICD, CPM 2005-09-08
13:50
Tokyo Kikai-Shinko-Kaikan Bldg. The Study of Silicon Stress for Stacked Die Packages
Kenji Abe, Eiichi Yamada, Yutaka Suzuki, Masazumi Amagai (TI Japan)
 [more] CPM2005-92 ICD2005-102
pp.41-44
ICD, CPM 2005-09-08
14:30
Tokyo Kikai-Shinko-Kaikan Bldg. The Study of Stress Sensor for Stacked Die Packages
Yutaka Suzuki, Kenji Abe, Eiichi Yamada, , Masazumi Amagai (TI Japan)
 [more] CPM2005-93 ICD2005-103
pp.45-48
ICD, CPM 2005-09-08
14:55
Tokyo Kikai-Shinko-Kaikan Bldg. Design and fabrication of MOS devices patterning with LCD image projection
Akira Nakada, Satoshi Wakimoto, Hiroshi Kubota (Kumamoto Univ.)
 [more]
ICD, CPM 2005-09-08
15:20
Tokyo Kikai-Shinko-Kaikan Bldg. 2 GHz Linear Amplifier Module with Feedforward Linearizer
Hiroyuki Kayano (Toshiba), Yuji Ohtsuka, Masao Suzuki, Masaya Ishiguro (TDMS), Tatsunori Hashimoto (Toshiba)
A feedforward linearizer amplifier module on a substrate we have developed is described. In particular, we report the ad... [more] CPM2005-94 ICD2005-104
pp.49-52
ICD, CPM 2005-09-08
15:45
Tokyo Kikai-Shinko-Kaikan Bldg. A CMOS Impulse Radio Ultra-Wideband Transceiver for 1Mb/s Data Communications and ±2.5cm Range Findings
Takahide Terada, Shingo Yoshizumi, Muhammad Muqsith, Yukitoshi Sanada, Tadahiro Kuroda (Keio Univ.)
 [more] CPM2005-95 ICD2005-105
pp.53-58
ICD, CPM 2005-09-09
09:00
Tokyo Kikai-Shinko-Kaikan Bldg. [Invited Talk] The study of the high frequency electrical characteristics in high-speed digital device mounting
Chihiro Ueda (AETJAPAN)
 [more] CPM2005-96 ICD2005-106
pp.1-5
ICD, CPM 2005-09-09
09:50
Tokyo Kikai-Shinko-Kaikan Bldg. Analysis of Transmission Characteristic of High-speed Differential Sgnal Bus
Tsuyoshi Tokiwa, Toshio Sudo (Toshiba), Nobuhiro Tsuruta (Toshiba DME), Yoshihiro Nishida (Toshiba DM)
With performance improvement of CPU, improvement of signal transmission ability between LSI became indispensable. And th... [more] CPM2005-97 ICD2005-107
pp.7-12
ICD, CPM 2005-09-09
10:15
Tokyo Kikai-Shinko-Kaikan Bldg. Measuemnt and Discussion of Degradation of Pulse Feature according with Line Length Increase
Koichi Yabuuchi (EMtech), Tamotsu Usami, Yutaka Akiyama, Kanji Otsuka (Meisei Univ.)
In this research, the single pulse (1kHz, 100kHz, 10MHz, 100MHz, and 500MHz) was inputted into coaxial cables 1m, 10m, a... [more] CPM2005-98 ICD2005-108
pp.13-16
ICD, CPM 2005-09-09
10:55
Tokyo Kikai-Shinko-Kaikan Bldg. Lead-free bumping and its process integrity for fine pitch interconnects
Hirokazu Ezawa, Masaharu Seto, Kazuhito Higuchi (Toshiba)
Electroplated solder bumps allow much finer pitch interconnection for high I/O applications, although controlling the al... [more] CPM2005-99 ICD2005-109
pp.17-22
ICD, CPM 2005-09-09
11:20
Tokyo Kikai-Shinko-Kaikan Bldg. Development of New Surface Finish Technology for Package Substrates with Excellent Bondability
Kiyotaka Tsukada (IBIDEN)
This Paper describes the characteristics, development, and application of
the surface finish technologies for chip pack... [more]
CPM2005-100 ICD2005-110
pp.23-27
ICD, CPM 2005-09-09
13:00
Tokyo Kikai-Shinko-Kaikan Bldg. Simultaneous switching noise(SSN) and EMI of a semiconductor package
Takanobu Kushihira (MSC), Toshio Sudo (TSB)
We tested a series about a Simultaneous Switching Noise(SSN) by influence of the parasitism inductance that a package ha... [more] CPM2005-101 ICD2005-111
pp.29-34
ICD, CPM 2005-09-09
13:25
Tokyo Kikai-Shinko-Kaikan Bldg. Study of 6Gbps Operation on 0.18um Node CMOS I/O Inverter with Transmission Structure in Signal and Power Distribution Lines
Yutaka Akiyama (Meisei Univ.), Tsuneo Ito (Excel Service), Kyouji Ito (Renesas NJS), Kanji Otsuka (Meisei Univ.)
This research acheeved measurement of the design which made transmission wiring for input and output to the 0.18um node ... [more] CPM2005-102 ICD2005-112
pp.35-40
 Results 1 - 20 of 22  /  [Next]  
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