IEICE Technical Committee Submission System
Conference Schedule
Online Proceedings
[Sign in]
Tech. Rep. Archives
    [Japanese] / [English] 
( Committee/Place/Topics  ) --Press->
 
( Paper Keywords:  /  Column:Title Auth. Affi. Abst. Keyword ) --Press->

All Technical Committee Conferences  (Searched in: All Years)

Search Results: Conference Papers
 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
 Results 41 - 60 of 139 [Previous]  /  [Next]  
Committee Date Time Place Paper Title / Authors Abstract Paper #
SRW 2018-08-20
09:55
Okayama Okayama Univ. A Study of Channel Bonding Configuration and Performance for Raspberry Pi Access-Point in Wireless Local-Area Network
Rahardhita Widyatra Sudibyo, Kyaw Soe Lwin, Nobuo Funabiki, Mousumi Saha, Minoru Kuribayashi (Okayama Univ.) SRW2018-10
Nowadays, IEEE 802.11 wireless local-area networks (WLANs) have been deployed everywhere by offering the flexible Intern... [more] SRW2018-10
pp.7-12
SRW 2018-08-20
10:20
Okayama Okayama Univ. A Throughput Estimation Model for Two Concurrently Communicating Links under Partially Overlapping Channels and Channel Bonding in IEEE 802.11n WLAN
Kwenga Ismael Munene, Kyaw Soe Lwin, Nobuo Funabiki, Minoru Kuribayashi (Okayama Univ.) SRW2018-11
The IEEE 802.11n wireless local-area network (WLAN) has been broadly deployed world-wide due to the flexibility, low cos... [more] SRW2018-11
pp.13-18
LQE 2018-07-12
14:20
Hokkaido   Hybrid-Integration Technologies of InP-SOA on Silicon Optical Platform
Takeshi Matsumoto, Teruo Kurahashi (Fujitsu Lab), Ryotaro Konoike, Keijiro Suzuki, Ken Tanizawa (AIST), Ayahito Uetake, Kazumasa Takabayashi (Fujitsu Lab), Kazuhiro Ikeda, Hitoshi Kawashima (AIST), Suguru Akiyama, Shigeaki Sekiguchi (Fujitsu Lab) LQE2018-23
We investigated hybrid-integration technologies of semiconductor optical amplifiers (SOAs) on Si optical platforms for o... [more] LQE2018-23
pp.13-16
LQE 2018-07-13
10:40
Hokkaido   [Invited Talk] Perspective of optical modulator using Si hybrid MOS phase shifter
Mitsuru Takenaka, Shinichi Takagi (Univ. Tokyo) LQE2018-31
We have proposed a Si hybrid MOS structure where a thin III-V semiconductor membrane is bonded on a Si waveguide with a ... [more] LQE2018-31
pp.43-46
LQE, LSJ 2018-05-25
13:25
Fukui   Comparison of GaInAsP laser diode between hydrophilic bonded InP/Si substrate and InP substrate
Hiromu Yada, Kazuki Uchida, Hirokazu Sugiyama, Periyanayagam Gandhi Kallarasan, Xu Han, Masaki Aikawa, Natsuki Hayasaka, Kazuhiko Shimomura (Sophia Univ.) LQE2018-16
We have proposed monolithic integration of optical device on hydrophilic bonded InP/Si substrate via MOVPE. We have fabr... [more] LQE2018-16
pp.25-28
NS 2018-04-19
13:00
Fukuoka Fukuoka Univ. [Encouragement Talk] Experimental Investigation of Effectiveness of Static Channel Bonding in Contention Environment with Other Wireless LAN
Kazuki Fujii, Hitomi Tamura (FIT), Daiki Nobayashi, Kazuya Tsukamoto (Kyutech) NS2018-1
Channel bonding technology, which bundles multiple adjacent channels, is one of the promising way for improving throughp... [more] NS2018-1
pp.1-6
NS, IN
(Joint)
2018-03-02
13:10
Miyazaki Phoenix Seagaia Resort Effective Channel Utilization Method for Dynamic Channel Bonding with heterogeneous communications
Sae Kajiwara, Daiki Nobayashi, Kazuya Tsukamoto (Kyutech) NS2017-218
The number of wireless LAN Access Points (APs) and devices has been drastically increasing in recent years, due to its s... [more] NS2017-218
pp.287-292
SDM 2018-02-08
16:10
Tokyo Tokyo Univ. [Invited Talk] Next Generation Circuit Fabrication by Molecular Bonding Technology
Akihiko Happoya (Toshiba), Kunio Mori (SCL) SDM2017-103
We have developed a molecular bonding technology that forms a layer of molecules on the surface of the adherends and pro... [more] SDM2017-103
pp.31-34
NS 2018-01-19
15:40
Okinawa Ishigakishi-Shoko-Kaikan Performance Analysis of Dynamic Channel Bonding with Partial Channel Collision -- In the case of 2*20MHz --
Kenji Sato (Kyutech), Hitomi Tamura (FIT), Daiki Nobayashi, Kazuya Tsukamoto, Kenji Kawahara (Kyutech) NS2017-163
Channel bonding is a technique to improve transmission rate by bonding multiple channels. Recently, the number of device... [more] NS2017-163
pp.111-116
ED, THz 2017-12-18
13:40
Miyagi RIEC, Tohoku Univ Low temperature liquid phase growth of Ge doped GaSe and GaSe1-xTex crystals for practical THz wave source
Yohei Sato, Chao Tang, Tadao Tanabe, Yutaka Oyama (Tohoku Univ.) ED2017-73
In this study, as nonlinear optical crystal using in THz wave generation, GaSe crystal is grown by solution growth. In t... [more] ED2017-73
pp.5-8
ICD, CPSY, CAS 2017-12-14
15:10
Okinawa Art Hotel Ishigakijima Comparisons of Wire Bonding and Flip-Chip Bonding in High Frequency Hysteretic DC-DC Buck Converter
Yuki Karasawa, Yusuke Gotou, Shintaro Hara, Takanobu Fukuoka, Kousuke Miyaji (Shinshu Univ.) CAS2017-92 ICD2017-80 CPSY2017-89
This work compares high frequency hysteretic buck converters implemented by chip-on-board wire bonding and flip-chip bon... [more] CAS2017-92 ICD2017-80 CPSY2017-89
p.129
MWP 2017-11-09
14:05
Tokyo Kikai-Shinko-Kaikan Bldg. [Invited Talk] Packaging of LiNbO3 optical device by low-temperature Au-Au bonding in ambient air
Ryo Takigawa (Kyushu Univ.) MWP2017-46
As an alternative to conventional AuSn solder bonding, we have developed low-temperature solid-state bonding method of A... [more] MWP2017-46
pp.7-11
OCS, OPE, LQE 2017-10-26
10:35
Kumamoto Josaien, Sakuranobaba Investigation of High Efficient Taper-type Mode Converter between III-V/SOI hybrid device and Si Waveguide
Junichi Suzuki, Kumi Nagasaka, Moataz Eissa, Fumihito Tachibana, Bai Liu, Takuya Mitarai, Tomohiro Amemiya, Nobuhiko Nishiyama, Shigehisa Arai (Tokyo Tech) OCS2017-38 OPE2017-70 LQE2017-43
In order to realize multi-functional III-V/SOI hybrid photonic integrated circuits, we fabricated a III-V/SOI hybrid sem... [more] OCS2017-38 OPE2017-70 LQE2017-43
pp.13-18
NS 2017-10-26
14:55
Osaka I-site nanba [Poster Presentation] Consideration of Effective Channel Utilization Method for Static Bonding with Communication Competition
Sae Kajiwara, Daiki Nobayashi, Kazuya Tsukamoto (Kyutech) NS2017-100
The number of wireless LAN devices has been drastically increasing in recent years, whereas the latest standard (802.11a... [more] NS2017-100
pp.59-60
NS, ASN, RCC, RCS, SR
(Joint)
2017-07-20
11:05
Hokkaido Hokkaido Univ. [Poster Presentation] Experimental Investigation of Performance and Frame Transmission Procedure on Chanel Bonding of 802.11ac Device
Kazuki Fujii, Hitomi Tamura (FIT), Daiki Nobayashi, Kazuya Tsukamoto (Kyutech) RCC2017-22 NS2017-43 RCS2017-114 SR2017-37 ASN2017-31
The most representative and important function for increasing the data transmission rate of IEEE 802.11ac, which was sta... [more] RCC2017-22 NS2017-43 RCS2017-114 SR2017-37 ASN2017-31
pp.73-78(RCC), pp.87-92(NS), pp.127-132(RCS), pp.85-90(SR), pp.105-110(ASN)
PN, NS, OCS
(Joint)
2017-06-16
11:15
Akita Akita Univ. Performance Analysis of Dynamic Channel Bonding with Partial Channel Collision -- Queueing Theory Approch --
Kenji Sato (Kyutech), Hitomi Tamura (FIT), Kazuya Tsukamoto (Kyutech) NS2017-25
Channel bonding, which is one of the latest technologies for the wireless LAN transmission rate by using consecutive mul... [more] NS2017-25
pp.17-22
MW
(2nd)
2017-06-14
- 2017-06-16
Overseas KMUTT, Bangkok, Thailand Stability of unloaded Q for 50GHz band TM0m0 mode cavity resonator using the thermal diffusion bonding
Takafumi Sasaki, Hikaru Inada, Takashi Shimizu, Yoshinori Kogami (Utsunomiya Univ.)
We proposed a novel 50GHz band TM0m0 mode cavity for the complex permittivity measurement of dielectric rod in the milli... [more]
CPM, LQE, ED 2016-12-13
11:20
Kyoto Kyoto University Development of wafer structure and monolithic integrated GaN-μLED driver circuit for large-scale optoelectonic chip
Kazuaki Tsuchiyama, Shu Utsuhomiya, Shota Nakagawa, Keisuke Yamane, Hiroto Sekiguchi, Hiroshi Okada, Akihiro Wakahara (Toyohashi Tech.) ED2016-73 CPM2016-106 LQE2016-89
A Si/SiO2/GaN-LED structure was fabricated by surface activated bonding method, and a GaN-µLED driver circuit consi... [more] ED2016-73 CPM2016-106 LQE2016-89
pp.79-83
R 2016-11-17
15:55
Osaka Osaka Central Electric Club Bldg. The effect of high gray-scale resolution for the high observation performance in X-ray inspection systems
Teruo Shibano (MELCO) R2016-53
In recent X-ray fluoroscopic inspection devices, the performances of the X-ray camera device are improved, they are bigg... [more] R2016-53
pp.23-28
LQE, OPE, EMD, R, CPM 2016-08-25
09:20
Hokkaido   Continuous-wave Operation of Ultra-short Cavity Membrane Lasers on Si Substrates
Erina Kanno, Koji Takeda, Takuro Fujii, Koichi Hasebe, Hidetaka Nishi, Tsuyoshi Yamamoto, Takaaki Kakitsuka, Shinji Matsuo (NTT) R2016-19 EMD2016-23 CPM2016-32 OPE2016-53 LQE2016-28
It is required to reduce energy consumptions of directly modulated semiconductor lasers to realize very short distance o... [more] R2016-19 EMD2016-23 CPM2016-32 OPE2016-53 LQE2016-28
pp.1-4
 Results 41 - 60 of 139 [Previous]  /  [Next]  
Choose a download format for default settings. [NEW !!]
Text format pLaTeX format CSV format BibTeX format
Copyright and reproduction : All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)


[Return to Top Page]

[Return to IEICE Web Page]


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan