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All Technical Committee Conferences (Searched in: All Years)
| Committee | Date Time | Place | Paper Title / Authors | Abstract | Paper # | |
| SDM | 2022-01-31 16:00 |
Online | Online | [Invited Talk]
**** Keiichi Nakazawa, Junpei Yamamoto, Shigetaka Mori, Shintaro Okamoto, Akito Shimizu, Koichi Baba, Nobutoshi Fujii, Mutsuo Uehara, Katsunori Hiramatsu, Hideomi Kumano, Akira Matsumoto, Koichiro Zaitsu, Hidetoshi Ohnuma, Keiji Tatani, Tomoyuki Hirano, Hayato Iwamoto (Sony Semiconductor Solutions)  SDM2021-73 |
We developed a new structure of pixel transistors stacked over photodiode named “2-Layer Transistor Pixel Stacked CMOS I... [more] | SDM2021-73 pp.20-23 |
| SDM | 2021-02-05 14:25 |
Online | Online | [Invited Talk]
Impacts of Misalignment on 1um Pitch Cu-Cu Hybrid Bonding Yoshihisa Kagawa, Takumi Kamibayashi, Masaki Haneda, Nobuotoshi Fujii, Syunsuke Furuse, Hideto Hashiguch, Tomoyuki Hirano, Hayato Iwamoto (SSS) SDM2020-58 |
In this study, we have successfully demonstrated the 1um pitch Cu-Cu hybrid bonding technology with remarkable electrica... [more] | SDM2020-58 pp.15-18 |
| CQ, CBE (Joint) |
2021-01-22 15:10 |
Online | Online | Improvement of Delayed Dynamic Bandwidth Channel Access Scheme for Fragments on IEEE 802.11ac Shono Niiyama, Shigetomo Kimura (Univ. of Tsukuba) CQ2020-102 |
IEEE802.11ac can provide wide band communications that equals to or grater than 20 MHz from the channel bonding. For s... [more] |
CQ2020-102 pp.160-165 |
| OPE, LQE | 2020-11-20 15:30 |
Online | Online | Research on Vertical Si Slot Waveguide Sensors Shuhei Yoshida, Hiromasa Shimizu (Tokyo univ. of agri. & tech.) OPE2020-67 LQE2020-47 |
Highly sensitive gas sensors are required for IOT. Conventional horizontal Si slot waveguide gas sensors are composed o... [more] | OPE2020-67 LQE2020-47 pp.110-115 |
| US | 2020-09-28 13:25 |
Online | Online | Propagation and Resonance Properties of Leaky SAW on Bonded Structures Consisting of Similar and Dissimilar Material Takumi Fujimaki, Masashi Suzuki, Shoji Kakio (Univ. of Yamanashi) US2020-33 |
The propagation and resonance properties of a leaky SAW (LSAW) on bonded structures comprising of similar and dissimilar... [more] | US2020-33 pp.35-40 |
| SDM | 2020-02-07 14:55 |
Tokyo | Tokyo University-Hongo | [Invited Talk]
A THIN BONDING MATERIAL FOR HIGH DENSITY HETEROGENEOUS INTEGRATION Yasuhisa Kayaba, Yuzo Nakamura, Jun Kamada, Takashi Kozeki, Kazuo Kohmura (MCI) SDM2019-95 |
A new thin bonding material was developed for the heterogeneous device chip integration by Cu-Cu hybrid bonding. The bon... [more] | SDM2019-95 pp.31-34 |
| VLD, DC, CPSY, RECONF, ICD, IE, IPSJ-SLDM, IPSJ-EMB, IPSJ-ARC (Joint) [detail] |
2019-11-15 14:15 |
Ehime | Ehime Prefecture Gender Equality Center | Triple-Layered Ring Oscillators and Image Sensors Developed by Direct Bonding of SOI Wafers Masahide Goto (NHK), Yuki Honda (NHK-ES), Toshihisa Watabe, Kei Hagiwara, Masakazu Nanba, Yoshinori Iguchi (NHK), Takuya Saraya, Masaharu Kobayashi (Univ. of Tokyo), Eiji Higurashi (AIST), Hiroshi Toshiyoshi, Toshiro Hiramoto (Univ. of Tokyo) ICD2019-38 IE2019-44 |
We have studied on pixel-parallel three-dimensional (3D) integrated CMOS image sensors. We previously reported double-la... [more] | ICD2019-38 IE2019-44 pp.45-49 |
| LQE, OPE, CPM, EMD, R | 2019-08-23 09:25 |
Miyagi | [Invited Talk]
Prospect of hybrid optical modulators using III-V membrane Mitsuru Takenaka, Qiang Li, Naoki Sekine, Shinichi Takagi (Univ.Tokyo) R2019-28 EMD2019-26 CPM2019-27 OPE2019-55 LQE2019-33 |
We have achieved extremely-high modulation efficiency using accumulated electrons in a hybrid MOS structure where a III-... [more] | R2019-28 EMD2019-26 CPM2019-27 OPE2019-55 LQE2019-33 pp.43-46 |
|
| IN, NS (Joint) |
2019-03-04 10:30 |
Okinawa | Okinawa Convention Center | Dynamic Decision Method of A-MPDU Size for Enabling Effective Dynamic Channel Bonding
-- Scheme Enhancement and Practical Verification -- Yusuke Shimizu, Daiki Nobayashi (Kyutech), Hitomi Tamura (FIT), Kazuya Tsukamoto (Kyutech) NS2018-206 |
Channel bonding that bundles multiple channels is one of the important technology for the very high throughput in IEEE ... [more] | NS2018-206 pp.75-80 |
| IN, NS (Joint) |
2019-03-04 10:50 |
Okinawa | Okinawa Convention Center | Experimental Evaluation on Effectiveness of IEEE802.11ac Channel Bonding in Competitive Environment Kazuki Fujii, Hitomi Tamura (FIT), Daiki Nobayashi, Kazuya Tsukamoto (Kyutech) NS2018-207 |
Channel bonding technology, which bundles multiple adjacent channels, is one of the promising way for improving throughp... [more] | NS2018-207 pp.81-86 |
| SDM | 2019-02-07 11:25 |
Tokyo | [Invited Talk]
Ultrafine 3D Interconnect Technology Using Directed Self-Assembly Takafumi Fukushima, Murugesan Mariappan, Mitsumasa Koyanagi (Tohoku Univ.) SDM2018-92 |
A directed self-assembly (DSA) technology is applied to fabricate ultrafine pitch TSV (Through-Silicon Vias) for ultra-h... [more] | SDM2018-92 pp.5-8 |
|
| SDM | 2019-02-07 16:10 |
Tokyo | [Invited Talk]
Fabrication of substrates with smooth Au surface for bonding at room temperature in atmospheric air Takashi Matsumae, Michitaka Yamamoto, Yuichi Kurashima, Eiji Higurashi, Hideki Takagi (AIST) SDM2018-97 |
e electroformed a Cu-based heat spreader with smooth Au thin film for room temperature bonding in atmospheric air. The C... [more] | SDM2018-97 pp.27-30 |
|
| NS | 2019-01-17 17:05 |
Nagasaki | Nagasaki Prefectural Art Museum | AP/STA Cooperative AP Selection Scheme for supporting Airtime Fairness in Heterogeneous AP Environment Syohei Arakaki, Kazuya Tsukamoto (kyutech) NS2018-188 |
Recently, the number of Wi-Fi enabled devises including public/private access points and terminals such as smartphone ha... [more] | NS2018-188 pp.59-64 |
| RCS, NS (Joint) |
2018-12-21 14:45 |
Hiroshima | Onomichi City Hall | A Proposal of Network Configuration Optimization Algorithm for Wireless Local-Area Network with Three Raspberry Pi Access-Points under Concurrent Communications Mousumi Saha, Nobuo Funabiki, Rahardhita Widyatra Sudibyo, Minoru Kuribayashi (Okayama Univ.), Wen-Chung Kao (National Taiwan Normal Univ.) NS2018-176 |
As a cost-effective, portable computing device, Raspberry Pi has become popular around the world since it can be used as... [more] | NS2018-176 pp.101-106 |
| ED, THz | 2018-12-17 16:35 |
Miyagi | RIEC, Tohoku Univ. | Direct determination of the interlayer van der Waals bonding force in graphene by thermal decomposition of SiC Tadao Tanabe, Tang Chao, Yoshiki Fuse, Kenta Sugawara, Takahiro Komiyama, Yohei Sato, Hirokazu Fukidome, Taiichi Otsuji, Yutaka Oyama (Tohoku Univ.) ED2018-59 |
Two-dimensional (2D) layered materials have attracted much interest because of their unique crystallographic structure a... [more] | ED2018-59 pp.25-26 |
| LQE, OPE, SIPH | 2018-12-06 17:10 |
Tokyo | Keio University | Examination of Chip-on-Wafer Plasma Activated Bonding Technology for III-V on Si hybrid Photonic Integrated Circuits LIU BAI (Tokyo Tech), Takehiko Kikuchi (SEI), Takuya Mitarai, Nobuhiko Nishiyama (Tokyo Tech), Hideki Yagi (SEI), Tomohiro Amemiya, Shigehisa Arai (Tokyo Tech) OPE2018-127 LQE2018-137 SIPH2018-43 |
[more] | OPE2018-127 LQE2018-137 SIPH2018-43 pp.149-153 |
| LQE, OPE, SIPH | 2018-12-06 17:10 |
Tokyo | Keio University | High optical coupling efficiency by double taper-type coupler structure towards III-V/Si hybrid photonic integration Takehiko Kikuchi (SEI/Tokyo Tech.), Junichi Suzuki, Fumihito Tachibana (Tokyo Tech.), Naoko Inoue, Hideki Yagi (SEI), Moataz Eissa, Takuya Mitarai, Tomohiro Amemiya, Nobuhiko Nishiyama, Shigehisa Arai (Tokyo Tech.) OPE2018-129 LQE2018-139 SIPH2018-45 |
The hybrid integration utilizing III-V based active devices with Si-Photonics is very attractive to realize new-generati... [more] | OPE2018-129 LQE2018-139 SIPH2018-45 pp.161-164 |
| VLD, DC, CPSY, RECONF, CPM, ICD, IE, IPSJ-SLDM, IPSJ-EMB, IPSJ-ARC (Joint) [detail] |
2018-12-07 15:15 |
Hiroshima | Satellite Campus Hiroshima | Quarter Video Graphics Array Image Sensor with Linear and Wide-Dynamic-Range Output Developed by Pixel-Wise 3D Integration Masahide Goto, Yuki Honda, Toshihisa Watabe, Kei Hagiwara, Masakazu Nanba, Yoshinori Iguchi (NHK), Takuya Saraya, Masaharu Kobayashi, Eiji Higurashi, Hiroshi Toshiyoshi, Toshiro Hiramoto (Univ. of Tokyo) CPM2018-97 ICD2018-58 IE2018-76 |
We report on pixel-parallel three-dimensional (3D) integrated CMOS image sensors. Photodiodes (PDs), pulse generation ci... [more] | CPM2018-97 ICD2018-58 IE2018-76 pp.43-48 |
| SR | 2018-10-30 10:30 |
Overseas | Mandarin Hotel, Bangkok, Thailand | [Poster Presentation]
Experimental Investigation of Static Channel Bonding Performance in Competitive Environment
-- Impact of Different MAC Procedures in 802.11ac -- Kazuki Fujii, Hitomi Tamura (FIT), Daiki Nobayashi, Kazuya Tsukamoto (Kyutech) SR2018-58 |
Channel bonding technology, which bundles multiple adjacent channels for frame transmission, is one of the promising way... [more] | SR2018-58 pp.1-2 |
| SRW | 2018-08-20 09:30 |
Okayama | Okayama Univ. | Modifications of Throughput Estimation Model for Concurrent Communications of Multiple Raspberry Pi Access-Points in Wireless Local-Area Network Mousumi Saha, Rahardhita Widyatra Sudibyo, Nobuo Funabiki, Minoru Kuribayashi (Okayama Univ.) SRW2018-9 |
As a cost-effective, portable computing device, Raspberry Pi has become popular around the world. It can be used as a so... [more] | SRW2018-9 pp.1-6 |
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