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All Technical Committee Conferences (Searched in: All Years)
| Committee | Date Time | Place | Paper Title / Authors | Abstract | Paper # | |
| SDM | 2024-02-21 15:50 |
Tokyo | Tokyo University-Hongo-Engineering Bldg.4 (Primary: On-site, Secondary: Online) |
[Invited Talk]
Recent Studies of WoW and CoW Cu-Cu Hybrid Bonding Yoshihisa Kagawa, Yukako Ikegami, Takahiro Kamei, Hayato Iwamoto (SSS)  SDM2023-87 |
In recent years, a variety of 3D stacked devices have been proposed. The Cu-Cu hybrid bonding that can realize high dens... [more] | SDM2023-87 pp.31-35 |
| AP | 2021-03-26 11:35 |
Online | Online | [Invited Talk (Young Researcher)]
Study of optically transparent antennas based on graphene Shohei Kosuga (Aoyama Gakuin Univ./JSPS Research Fellow), Shunichiro Nagata, Sho Kuromatsu, Ryosuke Suga, Takeshi Watanabe, Osamu Hashimoto, Shinji Koh (Aoyama Gakuin Univ.) AP2020-137 |
We focused on graphene, a one-atom-thick two dimensional carbon sheet, as an electrode material for optically transparen... [more] | AP2020-137 pp.31-36 |
| SDM | 2021-02-05 14:25 |
Online | Online | [Invited Talk]
Impacts of Misalignment on 1um Pitch Cu-Cu Hybrid Bonding Yoshihisa Kagawa, Takumi Kamibayashi, Masaki Haneda, Nobuotoshi Fujii, Syunsuke Furuse, Hideto Hashiguch, Tomoyuki Hirano, Hayato Iwamoto (SSS) SDM2020-58 |
In this study, we have successfully demonstrated the 1um pitch Cu-Cu hybrid bonding technology with remarkable electrica... [more] | SDM2020-58 pp.15-18 |
| SDM | 2020-02-07 14:55 |
Tokyo | Tokyo University-Hongo | [Invited Talk]
A THIN BONDING MATERIAL FOR HIGH DENSITY HETEROGENEOUS INTEGRATION Yasuhisa Kayaba, Yuzo Nakamura, Jun Kamada, Takashi Kozeki, Kazuo Kohmura (MCI) SDM2019-95 |
A new thin bonding material was developed for the heterogeneous device chip integration by Cu-Cu hybrid bonding. The bon... [more] | SDM2019-95 pp.31-34 |
| NLP, CCS | 2018-06-10 14:00 |
Kyoto | Kyoto Terrsa | Prediction of Foreign Exchange Rates by Price Quotations of Counterparty Banks
-- Using Collective Intelligence of Professional Views -- Takehiro Suzuki, Tomoya Suzuki (Ibaraki Univ.) NLP2018-47 CCS2018-20 |
In foreign-exchange (FX) dealing, FX brokers basically cancel out the orders from their customers to prevent the price f... [more] | NLP2018-47 CCS2018-20 pp.109-114 |
| VLD, DC, CPSY, RECONF, CPM, ICD, IE, IPSJ-SLDM, IPSJ-EMB, IPSJ-ARC (Joint) [detail] |
2017-11-07 09:50 |
Kumamoto | Kumamoto-Kenminkouryukan Parea | Performance Evaluation Three Dimensional FPGA Architecture with Face-down Stacking Keishiro Akashi, Motoki Amagasaki, Qian Zhao, Masahiro Iida, Morihiro Kuga, Toshinori Sueyoshi (Kumamoto Univ) RECONF2017-42 |
In recent years,Three-dimensional (3D) field-programmable gate arrays(FPGAs) are expected to offer higher logic density ... [more] | RECONF2017-42 pp.31-36 |
| MRIS, ITE-MMS | 2016-12-09 10:30 |
Ehime | Ehime Univ. | Sputter-deposition of inclined anisotropy film with Co/Pt atomic layer stacking Naoki Honda (Tohoku Inst. Tech.), Shintaro Hinata, Shin Saito (Tohoku Univ.) MR2016-38 |
Deposition of weakly inclined anisotropy film for bit-patterned media was studied. First, deposition of Co/Pt layer stac... [more] | MR2016-38 pp.51-56 |
| VLD, DC, CPSY, RECONF, CPM, ICD, IE (Joint) [detail] |
2016-11-29 10:55 |
Osaka | Ritsumeikan University, Osaka Ibaraki Campus | Development of power estimation tool for three dimensional FPGA Masato Ikebe, Qian Zhao, Motoki Amagasaki, Masahiro Iida, Morihiro Kuga, Toshinori Sueyoshi (Kumamoto Univ.) RECONF2016-46 |
Three-dimensional (3D) stacking technology is attractive for providing another way to improve the performance of the lar... [more] | RECONF2016-46 pp.35-40 |
| RECONF, CPSY, VLD, IPSJ-SLDM [detail] | 2015-01-30 17:30 |
Kanagawa | Hiyoshi Campus, Keio University | A Cache to Cache Communication Strategy for Wireless 3D Multi-Core Processors Masataka Matsumura (UEC), Masaaki Kondo (Univ. Tokyo), Hiroki Matsutani (Keio Univ.), Yasutaka Wada (Waseda Univ.), Hiroki Honda (UEC) VLD2014-152 CPSY2014-161 RECONF2014-85 |
The inductive-coupling 3D chip stacking technique has several advantages over TSV-based 3D stacking. For example, its ma... [more] | VLD2014-152 CPSY2014-161 RECONF2014-85 pp.245-250 |
| MRIS, ITE-MMS | 2014-12-12 09:50 |
Ehime | Ehime Univ. | Stacking structure dependence of magnetic properties of Co/Pt layer stacked film sputter - deposited at room temperature Taruho Tsuchiya, Naoki Honda, Hironaga Uchida (Tohoku Inst Tech), Shin Saito, Shintaro Hinata (Tohoku Univ) MR2014-38 |
Preparation of L11 ordered Co-Pt film with atomic layer stacking was investigated using room temperature sputtering aimi... [more] | MR2014-38 pp.59-64 |
| SDM | 2014-06-19 11:05 |
Aichi | VBL, Nagoya Univ. | Control of Stacking Fault Structures in Ge1-xSnx Epitaxial Growth Takanori Asano (Nagoya Univ.), Noriyuki Taoka (IHP Microelectronics), Osamu Nakatsuka, Shigeaki Zaima (Nagoya Univ.) SDM2014-47 |
Ge or Ge1－xSnx layer with (110) surface has attracted much attentions for Ge multi-gate MOS transistors. For forming a h... [more] | SDM2014-47 pp.21-25 |
| VLD | 2014-03-05 11:15 |
Okinawa | Okinawa Seinen Kaikan | Inductive-Coupling Interface for Multiple-Memory Chip Stacking Mitsuko Saito, Tadahiro Kuroda (Keio Univ.) VLD2013-159 |
Inductive-coupling interface for multiple-memory chip stacking is proposed. The number of stacked memory chips was limit... [more] | VLD2013-159 pp.137-140 |
| MRIS, ITE-MMS | 2013-12-12 16:15 |
Ehime | Ehime Univ. | Deposition of Co/Pt film with perpendicular magnetic anisotropy by layer stacking sputtering Taruho Tsuchiya, Naoki Honda (Tohoku Inst. of Tech.) MR2013-30 |
Low temperature preparation of Co/Pt stacked film with high magnetic anisotropy was studied using atomic layer stacking ... [more] | MR2013-30 pp.33-38 |
| MRIS, ITE-MMS | 2012-07-20 09:50 |
Ibaraki | Ibaraki Univ. | Perfect Hcp Atomic-layer Stacking for Sputtered Co Film with c-plane Sheet Texture by Substrate Heating Sputtering Naoki Nozawa, Shin Saito, Shintaro Hinata, Migaku Takahashi (Tohoku Univ.) MR2012-16 |
Effects of substrate heating of Co sputtered film with c-plane sheet texture on atomic-layer stacking were investigated ... [more] | MR2012-16 pp.41-46 |
| VLD, DC, IPSJ-SLDM, CPSY, RECONF, ICD, CPM (Joint) [detail] |
2010-11-30 10:25 |
Fukuoka | Kyushu University | [Invited Talk]
System Performance Improvement Expected for 3D LSI Chip Stacking Integration Technology Masahiro Aoyagi (AIST) CPM2010-134 ICD2010-93 |
3D LSI chip stacking integration technology using through-Si-via is very promising for future electronic hardware integr... [more] | CPM2010-134 ICD2010-93 pp.61-65 |
| ITE-MMS, MRIS | 2010-07-08 14:30 |
Ibaraki | Ibaraki Univ. | [Invited Talk]
Development of Pseudo-hcp Thin Films for Perpendicular Recording Media Shin Saito, Migaku Takahashi (Tohoku Univ.) MR2010-15 |
Measurement of the stacking faults (SFs) formed in a pseudo-hexagonal closed packed (pseudo-hcp) film is proposed using ... [more] | MR2010-15 pp.17-24 |
| ICD | 2010-04-23 15:40 |
Kanagawa | Shonan Institute of Tech. | A 2Gb/s 1.8pJ/b/chip Inductive-Coupling Through-Chip Bus for 128-Die NAND-Flash Memory Stacking Mitsuko Saito, Noriyuki Miura, Tadahiro Kuroda (Keio Univ.) ICD2010-19 |
128 chips are stacked using a spiral stair stacking scheme. The controller accesses a random memory chip at 2Gb/s by ind... [more] | ICD2010-19 pp.99-102 |
| ITE-MMS, MRIS | 2009-06-11 14:15 |
Miyagi | RIEC Tohoku Univ. | Uniaxial magnetocrystalline anisotropy of c-plane oriented Co100-xGex film with pseudo-hcp structure Shintaro Hinata, Shin Saito, Ryuichi Yanagisawa, Migaku Takahashi (Tohoku Univ.) MR2009-2 |
Effects of Ge addition into Co sputtered film on uniaxial magnetocrystalline anisotropy energy (Ku) were investigated. T... [more] | MR2009-2 pp.5-8 |
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