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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
 Results 1 - 20 of 21  /  [Next]  
Committee Date Time Place Paper Title / Authors Abstract Paper #
SDM 2019-02-07
11:25
Tokyo   [Invited Talk] Ultrafine 3D Interconnect Technology Using Directed Self-Assembly
Takafumi Fukushima, Murugesan Mariappan, Mitsumasa Koyanagi (Tohoku Univ.) SDM2018-92
A directed self-assembly (DSA) technology is applied to fabricate ultrafine pitch TSV (Through-Silicon Vias) for ultra-h... [more] SDM2018-92
pp.5-8
QIT
(2nd)
2018-11-26
13:30
Tokyo The University of Tokyo [Poster Presentation] Proposal of scalable silicon qubits with stacked structure for realizing multiple qubits
Yuki Ito, Masaharu Kobayashi, Toshiro Hiramoto (IIS)
We have proposed multiple silicon qubits with stacked structure. The qubits and single electron transistors (SETs) for r... [more]
SDM 2016-01-22
10:05
Tokyo Sanjo Conference Hall, The University of Tokyo [Invited Talk] Reliability Results of 4 million Micro Bump Interconnections of 3D Stacked 16 M Pixel Image Sensor
Yoshiaki Takemoto, Naohiro Takazawa, Mitsuhiro Tsukimura, Haruhisa Saito, Toru Kondo, Hideki Kato, Jun Aoki, Kenji Kobayashi, Shunsuke Suzuki, Yuichi Gomi, Seisuke Matsuda, Yoshitaka Tadaki (Olympus) SDM2015-108
We evaluated the reliability of 3D stacked CMOS image sensors (CISs) with 4 million micro bump inter-connections at a 7.... [more] SDM2015-108
pp.1-4
VLD, CPSY, RECONF, IPSJ-SLDM, IPSJ-ARC [detail] 2016-01-20
09:00
Kanagawa Hiyoshi Campus, Keio University A Chip Evaluation of the Heat Generation in 3D stacked LSI
Tatsuya Wada, Kimiyosi Usami (Shibaura IT) VLD2015-87 CPSY2015-119 RECONF2015-69
Heat is one of the problems in the three-dimensional stacking technology of LSI. We have developed a three-dimensional s... [more] VLD2015-87 CPSY2015-119 RECONF2015-69
pp.85-90
AP
(2nd)
2014-05-15
- 2014-05-16
Ishikawa The Kanazawa Theatre Radiation Efficiency Enhancement of Electrically Small and Low-Profile Antenna Using Capacitive Feed Structure
Takeshi Fukusako, Hiroyuki Maema (Kumamoto Univ.)
Effects of stacking on radiation efficiency are studied for an electrically small and low-profile meandered line antenna... [more]
MW 2014-03-05
09:50
Ehime Ehime University A Development of Quasi-Multilayered Striplines Multi-Harmonic Absorption Filter Using Substrate-Stacked Structure
Yasuo Morimoto, Takeshi Yuasa, Tetsu Owada, Moriyasu Miyazaki (Mitsubishi Electric) MW2013-212
A novel multi-harmonic absorption filter that uses quasi-multilayered striplines for power amplifiers is presented. The ... [more] MW2013-212
pp.89-94
EST, MWP, OPE, MW, EMT, IEE-EMT [detail] 2013-07-19
10:15
Hokkaido Wakkanai Synthesis Cultural Center Electro-Optic Modulators Using Double-Antenna-Coupled Electrode Array for Wireless Millimeter-wave - Lightwave Signal Conversion
Naohiro Kohmu, Hiroshi Murata, Yasuyuki Okamura (Osaka Univ.) MW2013-83 OPE2013-52 EST2013-47 MWP2013-42
In this report, we propose a new electro-optic (EO) modulator utilizing double-antenna-coupled resonant electrodes and t... [more] MW2013-83 OPE2013-52 EST2013-47 MWP2013-42
pp.225-230
OME, IEE-DEI 2013-07-04
16:25
Niigata   [Invited Talk] Fabrication of Stacked Logic Circuits for Printed Integrated Circuits
Kazuhiro Kudo, Isao Kodera, Hiroshi Yamauchi, Shigekazu Kuniyoshi, Masatoshi Sakai (Chiba Univ.) OME2013-47
We have demonstrated logic circuit operations of stacked-structure thin film transistor (TFT) circuits using TIPS-pentac... [more] OME2013-47
pp.25-30
OME 2012-11-19
16:15
Osaka Room 302, Nakanoshima Ctr., Osaka Univ. Fabrication of Stacked NAND Circuits using Solution-Processable Materials
Isao Kodera, Hiroshi Yamauchi, Shigekazu Kuniyoshi, Masatoshi Sakai, Masaaki Iizuka, Kazuhiro Kudo (Chiba Univ.) OME2012-73
In this study, we have demonstrated the NAND operation of a stacked-structure NAND circuit using TIPS-pentacene (6,13-Bi... [more] OME2012-73
pp.61-64
SDM 2012-06-21
16:35
Aichi VBL, Nagoya Univ. Interface controlled silicide Schottky S/D for future 3D devices
Yuta Tamura, Ryo Yoshihara, Kuniyuki Kakushima, Parhat Ahmet, Yoshinori Kataoka, Akira Nishiyama, Nobuyuki Sugii, Kazuo Tsutsui, Kenji Natori, Takeo Hattori, Hiroshi Iwai (Tokyo Tech) SDM2012-59
This paper presents Ni/Si stacked-structure as interface control for silicidation. An atomically flat $NiSi_2$ film inte... [more] SDM2012-59
pp.87-92
SDM 2011-07-04
17:00
Aichi VBL, Nagoya Univ. Design of stacked NOR type PRAM with phase change channel transistor
Sho Kato, Shigeyoshi Watanabe (Shonan Institute of Technology) SDM2011-69
In this paper stacked NOR type PRAM with phase change channel transistor has been newly proposed. Fast access time compe... [more] SDM2011-69
pp.109-113
IPSJ-SLDM, SIP, IE, ICD [detail] 2010-10-05
13:20
Chiba Makuhari Messe, International Conference Hall Study of stacked NOR type MRAM using spin transistor
Shouto Tamai, Shigeyoshi Watanabe (sit) SIP2010-55 ICD2010-69 IE2010-73
In this paper stacked NOR type MRAM with vertical spin transistor has been newly proposed. Word line scheme surrounded b... [more] SIP2010-55 ICD2010-69 IE2010-73
pp.37-42
ICD, SDM 2010-08-27
11:40
Hokkaido Sapporo Center for Gender Equality Study of stacked MRAM for universal memory
Shouto Tamai, Shigeyoshi Watanabe (Shonan Inst. of Tech.) SDM2010-142 ICD2010-57
In this paper stacked NOR type MRAM with vertical spin transistor has been newly proposed. Word line scheme surrounded b... [more] SDM2010-142 ICD2010-57
pp.99-104
ED, SDM 2010-07-02
16:05
Tokyo Tokyo Inst. of Tech. Ookayama Campus The optimum physical targets of the 3-dimensional vertical FG NAND flash memory cell arrays with the extended sidewall control gate (ESCG) structure
Moon-Sik Seo (Tohoku Univ.), Tetsuo Endoh (Tohoku Univ./JST) ED2010-101 SDM2010-102
Recently, the 3-dimensional vertical Floating Gate (FG) NAND flash memory cell arrays with the extended sidewall control... [more] ED2010-101 SDM2010-102
pp.225-230
ICD 2009-12-14
13:30
Shizuoka Shizuoka University (Hamamatsu) [Poster Presentation] Design Technology of stacked NAND type MRAM
Shouto Tamai, Shigeyoshi Watanabe (Shonan Inst. of Tech.) ICD2009-79
Design technology of stacked type MRAM using spin transistor has been described. Using 64 layer level cell structure fea... [more] ICD2009-79
pp.19-23
ITE-MMS, MRIS 2009-12-10
14:00
Ehime Ehime Univ. Read-Write Characteristics Evaluation of BPM with Static Tester
Hajime Aoi (Tohoku Univ.), Hideki Saga (Tohoku Univ./Hitachi Ltd,), Ryosuke Tatsuno, Kazuki Shirahata, Kaname Mitsuzuka, Kenji Miura, Takehito Shimatsu, Hiroaki Muraoka (Tohoku Univ.) MR2009-39
Basic read-write characteristics of bit-patterned media (BPM) were empirically investigated. For this experiments, sampl... [more] MR2009-39
pp.13-18
ICD, SDM 2009-07-17
11:15
Tokyo Tokyo Institute of Technology [Invited Talk] Impact of Silicon Technology in "Beyond CMOS" World
Tetsuo Endoh, Takahiro Hanyu (Tohoku Univ.) SDM2009-111 ICD2009-27
In recent years, the Beyond CMOS technology is studied in addition to More Moore technology and More than Moore technolo... [more] SDM2009-111 ICD2009-27
pp.73-78
SDM, ED 2009-06-26
09:30
Overseas Haeundae Grand Hotel, Busan, Korea [Invited Talk] Future High Density Memory with Vertical Structured Device Technology
Tetsuo Endoh (Tohoku Univ.) ED2009-95 SDM2009-90
For the past thirty years, the downscaling has been the guiding principle in the field of High-density semiconductor mem... [more] ED2009-95 SDM2009-90
pp.193-196
SDM, ED 2008-07-10
09:30
Hokkaido Kaderu2・7 3-dimensional Terraced NAND(3D TNAND) Flash Memory
Yoon Kim, Gil-Seong Lee, Jong Duk Lee, Hyungcheol Shin, Byung-Gook Park (Seoul National Univ.) ED2008-56 SDM2008-75
We propose the 3-dimensional terraced NAND flash memory. It has a vertical channel so it can be possible to make a enoug... [more] ED2008-56 SDM2008-75
pp.85-88
AP 2008-03-14
15:40
Aichi Nanzan Univ. Triple Frequency Wide band Microstrip Antennas With Ring Parasitic
Hiroya Tanaka, Kenichi Kagoshima, Shigeki Obote (Ibaraki Univ.) AP2007-197
In this report, it proposed the multi-band wideband antenna that was able to share three frequencies of frequency ratio... [more] AP2007-197
pp.141-146
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