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Committee Date Time Place Paper Title / Authors Abstract Paper #
CPM, ICD 2008-01-18
14:15		 Tokyo Kikai-Shinko-Kaikan Bldg Assessment Test for Solder Joint Reliability in Mobile Products
Masazumi Amagai, Hiroyuki Sano (TI Japan) CPM2007-144 ICD2007-155		 When a mobile phone is dropped, the frequency of occurrence of cracks in solder joints is high. Voids in intermetallic ... [more] CPM2007-144 ICD2007-155
pp.93-98
CPM, ICD 2008-01-18
16:10		 Tokyo Kikai-Shinko-Kaikan Bldg Reliability evaluation of lead free solder joint against vibration load under thermal circumstance
Michiya Matsushima (Osaka Univ.), Toshiyuki Hamano (ESPEC), Kiyokazu Yasuda, Kozo Fujimoto (Osaka Univ.) CPM2007-148 ICD2007-159		 The reliability of electronics solder joints is evaluated for each individual stress even if the electronics devices are... [more] CPM2007-148 ICD2007-159
pp.117-122
ICD, CPM 2005-09-09
10:55		 Tokyo Kikai-Shinko-Kaikan Bldg. Lead-free bumping and its process integrity for fine pitch interconnects
Hirokazu Ezawa, Masaharu Seto, Kazuhito Higuchi (Toshiba) 		Electroplated solder bumps allow much finer pitch interconnection for high I/O applications, although controlling the al... [more] CPM2005-99 ICD2005-109
pp.17-22
ICD, CPM 2005-09-09
11:20		 Tokyo Kikai-Shinko-Kaikan Bldg. Development of New Surface Finish Technology for Package Substrates with Excellent Bondability
Kiyotaka Tsukada (IBIDEN) 		This Paper describes the characteristics, development, and application of
the surface finish technologies for chip pack... [more]		 CPM2005-100 ICD2005-110
pp.23-27
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